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    Adhesive Composition and Article
    1.
    发明申请
    Adhesive Composition and Article 审中-公开
    粘合剂组合物及其制品

    公开(公告)号：US20150056443A1

    公开(公告)日：2015-02-26

    申请号：US14010386

    申请日：2013-08-26

    Applicant: Tyco Electronics Corporation

    Inventor： Lei Wang ,  Hyo Chang Yun ,  David A. Hurrell

    IPC: C09J127/20

    CPC classification number: C09J127/20 ,  C08L27/12 ,  C08L27/16 ,  C08L27/18 ,  C08L2205/025 ,  C09J127/12 ,  C09J127/16 ,  C09J127/18 ,  Y10T428/2878

    Abstract: An adhesive composition blend and an article are disclosed. The adhesive composition blend includes a higher-melt fluoropolymer component having a melting point greater than a predetermined maximum service temperature and a lower-melt fluoropolymer component having a melting point less than a predetermined applying temperature. The melting point of the higher-melt fluoropolymer is at least 20° C. greater than the melting point of the lower-melt fluoropolymer. Additionally or alternatively, the adhesive composition blend includes a higher-melt fluoropolymer component having a melting point between about 200° C. and about 330° C. and a lower-melt fluoropolymer component having a melting point between about 100° C. and about 260° C. The article includes a substrate and the adhesive.

    Abstract translation: 公开了粘合剂组合物共混物和制品。 粘合剂组合物共混物包括具有大于预定最大使用温度的熔点的较高熔点含氟聚合物组分和熔点小于预定施加温度的较低熔点氟聚合物组分。 较高熔点含氟聚合物的熔点比低熔点含氟聚合物的熔点高至少20℃。 另外或替代地，粘合剂组合物共混物包括熔点在约200℃和约330℃之间的较高熔点含氟聚合物组分和熔点在约100℃和约 260℃。该制品包括基底和粘合剂。

    Adhesive Manufacturing Process, an Adhesive, and an Article
    3.
    发明申请
    Adhesive Manufacturing Process, an Adhesive, and an Article 审中-公开
    粘合剂制造工艺，粘合剂和条款

    公开(公告)号：US20150056444A1

    公开(公告)日：2015-02-26

    申请号：US14010409

    申请日：2013-08-26

    Applicant: Tyco Electronics Corporation

    Inventor： Lei Wang ,  Hyo Chang Yun

    IPC: C09J127/20

    CPC classification number: C09J127/20 ,  C08K3/08 ,  C08K2003/085 ,  C08L27/18 ,  C08L2205/02 ,  C09J127/18 ,  Y10T428/2878

    Abstract: An adhesive manufacturing process, an adhesive, and an article are disclosed. The adhesive manufacturing process includes blending a lower-melt fluoropolymer having a melting point that is less than a first temperature with a fluoropolymer powder having a melting point that is greater than a second temperature to form an adhesive and applying the adhesive to a surface at the first temperature. The adhesive is configured to be exposed to the second temperature. The adhesive includes the lower-melt fluoropolymer and the fluoropolymer powder blended with the lower-melt fluoropolymer. The article includes a surface and the adhesive applied to the surface at an applying temperature.

    Abstract translation: 公开了粘合剂制造方法，粘合剂和制品。 粘合剂制造方法包括将具有小于第一温度的熔点的低熔点含氟聚合物与熔点大于第二温度的氟聚合物粉末混合以形成粘合剂，并将粘合剂施加到 第一温度。 粘合剂被配置为暴露于第二温度。 粘合剂包括与下部熔融含氟聚合物共混的低熔点含氟聚合物和含氟聚合物粉末。 该制品包括在施加温度下施加到表面的表面和粘合剂。

    Electrical device having reduced arc tracking
    4.
    发明授权
    Electrical device having reduced arc tracking 有权

    公开(公告)号：US09954291B2

    公开(公告)日：2018-04-24

    申请号：US15173855

    申请日：2016-06-06

    Applicant: TYCO ELECTRONICS CORPORATION

    Inventor： Lei Wang ,  Hyo Chang Yun ,  Peter J. Dutton

    IPC: H01R9/24

    CPC classification number: H01R9/2491 ,  H01R13/53 ,  H01R13/533

    Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.

    Dissipative Article and Process of Producing Dissipative Article
    6.
    发明申请
    Dissipative Article and Process of Producing Dissipative Article 审中-公开
    耗散物品和制造耗散物品的流程

    公开(公告)号：US20160268016A1

    公开(公告)日：2016-09-15

    申请号：US14657998

    申请日：2015-03-13

    Applicant: Tyco Electronics Corporation

    Inventor： Hyo Chang Yun ,  Lei Wang ,  Peter J. Dutton

    IPC: H01B1/24 ,  H01B13/00 ,  B64G1/22

    CPC classification number: H01B1/24 ,  B64G1/226

    Abstract: Static dissipative articles and processes of producing static dissipative articles are described. The static dissipative article includes a conductor and a dissipative coating over the conductor, the dissipative coating including a polymer matrix and between 0.1 and 10%, by weight, conductive nano-carbons homogenously distributed with the polymer matrix. The dissipative coating has a resistivity of between 106 and 1014 ohm·cm, and the conductive-nano-carbons have an aspect ratio of at least 100. The process of producing a coated article includes blending a polymer powder with between 0.1 and 10%, by weight, conductive nano-carbons to form a micron-level homogenous compound, and extruding the compound onto a conductor to form a dissipative coating over the conductor.

    Abstract translation: 描述了制造静电耗散物品的静电耗散物品和工艺。 静电耗散物品包括在导体上的导体和耗散涂层，耗散涂层包括聚合物基质，和0.1-10重量％的与聚合物基体均匀分布的导电纳米碳。 耗散涂层具有介于106和1014欧姆·厘米之间的电阻率，并且导电纳米碳具有至少100的纵横比。制造涂覆制品的方法包括将聚合物粉末混合在0.1至10％之间， 的导电纳米碳以形成微米级的均匀化合物，并将该化合物挤出到导体上以在导体上形成耗散的涂层。

    Modular Enclosure
    7.
    发明申请
    Modular Enclosure 有权
    模块化外壳

    公开(公告)号：US20150289389A1

    公开(公告)日：2015-10-08

    申请号：US14245607

    申请日：2014-04-04

    Applicant: Tyco Electronics Corporation

    Inventor： Bruce R. Conway ,  Hyo Chang Yun ,  Peter J. Dutton ,  Thomas D. Ratzlaff ,  Paul Craig Tally ,  James O'Keeffe ,  Erling Hansen

    IPC: H05K5/00 ,  H05K5/03 ,  B65D21/02 ,  H05K5/02

    CPC classification number: B65D21/0209 ,  H05K5/0021 ,  H05K7/1468

    Abstract: An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.

    Abstract translation: 壳体包括多个模块化角部段和连接在一起以至少部分地限定外壳的内部隔室的多个模块化壁段。 壁段在相对的自由端之间延伸长度。 至少大部分壁段由聚合物制成。 每个角部段包括相对的第一和第二接收器插座，每个接收器插座被配置为在其中接收相应的壁段的相应的自由端，以将角部段连接到相应的壁段。 至少大部分角部由聚合物制成。 角部段和壁段连接在一起以限定外壳的内部隔间。

    Modular Enclosure
    8.
    发明申请
    Modular Enclosure 有权
    模块化外壳

    公开(公告)号：US20150289388A1

    公开(公告)日：2015-10-08

    申请号：US14245588

    申请日：2014-04-04

    Applicant: Tyco Electronics Corporation

    Inventor： Bruce R. Conway ,  Hyo Chang Yun ,  Peter J. Dutton ,  Thomas D. Ratzlaff ,  Paul Craig Tally ,  James O'Keeffe ,  Erling Hansen

    IPC: H05K5/00 ,  H05K5/03 ,  H05K5/02

    CPC classification number: H05K5/0021 ,  H05K7/1425 ,  H05K7/1471

    Abstract: An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit comprises a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.

    Abstract translation: 外壳包括连接在一起以至少部分地限定外壳的内部隔间的多个模块化结构单元。 每个结构单元包括从角端延伸到自由端的长度的壁段和从壁段的角端向外延伸的角部段。 角部与壁部一体形成。 角部段包括接收器插座，其被配置为接收其中的另一相应结构单元的自由端，以将构造单元连接在一起。 建筑单元一个接一个地以一个追逐对称的方式连接在一起，以定义外壳的内部隔间。

    ELECTRICAL DEVICE HAVING REDUCED ARC TRACKING
    9.
    发明申请
    ELECTRICAL DEVICE HAVING REDUCED ARC TRACKING 有权

    公开(公告)号：US20170352966A1

    公开(公告)日：2017-12-07

    申请号：US15173855

    申请日：2016-06-06

    Applicant: TYCO ELECTRONICS CORPORATION

    Inventor： Lei Wang ,  Hyo Chang Yun ,  Peter J. Dutton

    IPC: H01R9/24

    CPC classification number: H01R9/2491 ,  H01R13/53 ,  H01R13/533

    Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.

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