公开(公告)号：US20090277379A1

公开(公告)日：2009-11-12

申请号：US12311396

申请日：2007-09-28

申请人： Tadahiro Ohmi ,  Ryoichi Ohkura ,  Osamu Nakamura ,  Takaaki Matsuoka

发明人： Tadahiro Ohmi ,  Ryoichi Ohkura ,  Osamu Nakamura ,  Takaaki Matsuoka

IPC分类号： B05B13/02

CPC分类号： G11B5/84 ,  G03F7/162 ,  G11B7/261 ,  H01L21/6715 ,  H01L21/6838

摘要： A gas ejected from a sonic nozzle toward the rear surface of a wafer. The flow speed of the gas flowing to the outer circumference side along the rear surface of the wafer is increased between the rear surface of the wafer and a second cup and is kept by Bernoulli's effects. Thus, flapping of wafer is suppressed. Furthermore, a resist solution is prevented from flowing around to the rear surface.

摘要翻译： 从声波喷嘴朝向晶片的后表面喷射的气体。 沿着晶片的后表面流动到外周侧的气体的流速在晶片的后表面和第二杯之间增加，并且保持由伯努利的作用。 因此，抑制了晶片的振荡。 此外，防止抗蚀剂溶液流到背面。

公开(公告)号：US20090107521A1

公开(公告)日：2009-04-30

申请号：US12296989

申请日：2007-04-11

申请人： Tadahiro Ohmi ,  Akinobu Teramoto ,  Jiro Yamanaka ,  Nobutaka Mizutani ,  Osamu Nakamura ,  Takaaki Matsuoka ,  Ryoichi Ohkura

发明人： Tadahiro Ohmi ,  Akinobu Teramoto ,  Jiro Yamanaka ,  Nobutaka Mizutani ,  Osamu Nakamura ,  Takaaki Matsuoka ,  Ryoichi Ohkura

IPC分类号： B08B3/00 ,  F16L11/04 ,  F16L11/20

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： By adding a perfluoromonomer to PVDF being a fluororesin to soften it, the oxygen permeability can be significantly reduced and a flexible fluororesin tube can be obtained. The oxygen permeability can also be reduced by providing a nylon tube as an outer layer. The tube is used between a chemical solution or ultrapure water feeder and a chemical solution or ultrapure water utilizing apparatus such as a cleaning apparatus or a wet etching apparatus.

摘要翻译： 通过向作为氟树脂的PVDF添加全氟单体使其软化，可以显着降低透氧性，并且可以获得柔性的氟树脂管。 也可以通过提供尼龙管作为外层来降低透氧性。 该管用于化学溶液或超纯水给水器和化学溶液或超纯水利用设备如清洁设备或湿蚀刻设备。

公开(公告)号：US06752877B2

公开(公告)日：2004-06-22

申请号：US09948952

申请日：2001-09-10

申请人： Yuji Ono ,  Ryoichi Ohkura

发明人： Yuji Ono ,  Ryoichi Ohkura

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

公开(公告)号：US06792959B2

公开(公告)日：2004-09-21

申请号：US10437891

申请日：2003-05-15

申请人： Yuji Ono ,  Ryoichi Ohkura

发明人： Yuji Ono ,  Ryoichi Ohkura

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

摘要翻译： 在密封的清洁壳体中单独湿式清洁晶片的单片式湿式清洁技术，其单独地不存储在盒中，其前表面和后表面上并未存储在盒中，由此多个化学流体被垂直并顺序地供应 从多个上侧供给喷嘴25和下侧供给喷嘴26到各晶片W的正面和背面进行清洗，净化水总是从下侧供给喷嘴26,26流出。 。 。 ，其不供给下侧供应喷嘴的化学流体，从而防止在清洁处理之间发生各种化学流体的交叉污染。

公开(公告)号：US06763839B2

公开(公告)日：2004-07-20

申请号：US09871250

申请日：2001-06-01

申请人： Ryoichi Ohkura ,  Yuji Ono ,  Hiroshi Yamaguchi ,  Miyuki Takaishi ,  Hideo Kamikochi

发明人： Ryoichi Ohkura ,  Yuji Ono ,  Hiroshi Yamaguchi ,  Miyuki Takaishi ,  Hideo Kamikochi

IPC分类号： B08B300

CPC分类号： H01L21/67196 ,  H01L21/67017 ,  H01L21/67766 ,  H01L21/67781 ,  Y10S134/902

摘要： A substrate cleaning system for cleaning wafers using a sheet-type wet cleaning treatment. The system has a sealable system body, a loading/unloading booth having a substrate carry-in section in which a plurality of substances are stocked to be carried in before a cleaning treatment is applied to them and a substrate carry-out section in which a plurality of substrates are stocked to be carried out after the cleaning treatment is applied, a processing booth provided with at least one sheet-type substrate cleaning chamber in which the cleaning treatment can be applied to a plurality of substrates by a plurality of cleaning solutions, and a robot booth provided with a transport robot for transporting the substrates one by one between the processing booth and the loading/unloading booth, the respective booths having partition walls.

摘要翻译： 一种用于使用片式湿式清洗处理来清洗晶片的基板清洁系统。 该系统具有可密封的系统主体，一个装载/卸载舱，具有一个基板输入部分，在该部分中多个物质被储存在其上施加清洁处理之前被运载;以及基板执行部分，其中 在施加清洁处理之后，多个基板被储存以进行，设置有至少一个片状基板清洁室的处理室，其中可以通过多个清洁溶液将清洁处理应用于多个基板， 以及设置有运送机器人的机器人展位台，用于在处理室和装卸台之间逐一运送基板，各个展位具有分隔壁。

公开(公告)号：US07029538B2

公开(公告)日：2006-04-18

申请号：US09940788

申请日：2001-08-29

申请人： Yuji Ono ,  Ryoichi Ohkura

发明人： Yuji Ono ,  Ryoichi Ohkura

IPC分类号： B08B5/00 ,  F26B21/00

CPC分类号： H01L21/681 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

摘要： In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.

公开(公告)号：US06807974B2

公开(公告)日：2004-10-26

申请号：US10286818

申请日：2002-11-04

申请人： Yuji Ono ,  Ryoichi Ohkura

发明人： Yuji Ono ,  Ryoichi Ohkura

IPC分类号： B08B500

CPC分类号： H01L21/681 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

摘要： In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.

摘要翻译： 在用于清洗不存储在盒中的晶片的单晶片型衬底清洁系统的干燥步骤中，在密封的清洁壳体中，当晶片被支撑并高速旋转时，将晶片进行旋转干燥处理，同时将惰性气体 为了防止氧化被提供到晶片的表面，并且在晶片的外周部分提供给晶片表面的惰性气体的量比在其中心处供应的那样大， 有效地面对晶片，同时优化单晶片型清洁系统的优点。

公开(公告)号：US5423377A

公开(公告)日：1995-06-13

申请号：US114628

申请日：1993-09-02

申请人： Kazuya Iwata ,  Yoosyun Horibe ,  Yoshio Sumiya ,  Ryoichi Ohkura

发明人： Kazuya Iwata ,  Yoosyun Horibe ,  Yoshio Sumiya ,  Ryoichi Ohkura

IPC分类号： F01K9/00 ,  F28B9/08 ,  F28B11/00

CPC分类号： F28B9/08 ,  F01K9/00

摘要： In the operation of a main steam condenser of a steam turbine driven by a boiler and having a gland steam condenser, the gland steam condensate is normally fed from the gland steam condenser into the main condenser condensate. To avoid contamination of the main condenser condensate by oxygen-rich water, for at least part of the start-up period of the turbine, the gland steam condensate and other drain accumulating in the condenser is prevented from entering the main condenser condensate which is to be fed to the boiler. The gland steam condensate is fed to said main condenser and stored in a reservoir separate from the hot well thereof, to undergo de-aeration before being fed into the main condenser condensate.

摘要翻译： 在由锅炉驱动并具有压盖蒸汽冷凝器的蒸汽轮机的主蒸汽冷凝器的操作中，压盖蒸汽冷凝物通常从压盖蒸汽冷凝器进入主冷凝器冷凝物。 为了避免主冷凝器冷凝物被富氧水污染，对于涡轮机的至少部分启动期间，可以防止积聚在冷凝器中的压缩空气冷凝水和其他排水进入主冷凝器冷凝水 供给锅炉。 压盖蒸汽冷凝物被供给到所述主冷凝器并储存在与其热井分开的储存器中，以在进入主冷凝器冷凝物之前进行通气。