公开(公告)号：US20120001544A1

公开(公告)日：2012-01-05

申请号：US12904512

申请日：2010-10-14

申请人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

发明人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

IPC分类号： H01J7/44 ,  H01J9/00

CPC分类号： H01L25/167 ,  H01L27/3276 ,  H01L27/3288 ,  H01L33/641 ,  H01L51/529 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.

摘要翻译： 公开了发光模块和制造发光模块的方法。 发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用 驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

公开(公告)号：US20120275116A1

公开(公告)日：2012-11-01

申请号：US13449486

申请日：2012-04-18

申请人： Cheol Ho HEO

发明人： Cheol Ho HEO

IPC分类号： H05K7/20

CPC分类号： H01L23/36 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Disclosed herein is a heat radiating substrate employed in an LED package. The heat radiating substrate includes a printed circuit board made of a metal material, and having a light emitting device mounted on an upper surface thereof; a heat radiating plate provided on a lower surface of the printed circuit board to receive the heat conducted from the light emitting device to the printed circuit board and radiate the heat to the outside; and a heat radiating layer formed on a lateral surface of the printed circuit board to radiate the heat conducted to the printed circuit board to the outside through the lateral surface of the printed circuit board.

摘要翻译： 本文公开了用于LED封装中的散热基板。 散热基板包括由金属材料制成的印刷电路板，并且具有安装在其上表面上的发光器件; 设置在印刷电路板的下表面上以将从发光器件传导到印刷电路板的热量辐射到外部的散热板; 以及形成在印刷电路板的侧表面上的散热层，以通过印刷电路板的侧表面将传导到印刷电路板的热辐射到外部。

公开(公告)号：US20130183479A1

公开(公告)日：2013-07-18

申请号：US13784321

申请日：2013-03-04

申请人： Myung Gun CHONG ,  Cheol Ho HEO ,  Sang Hyuk SON ,  Dae Hyung YOU

发明人： Myung Gun CHONG ,  Cheol Ho HEO ,  Sang Hyuk SON ,  Dae Hyung YOU

IPC分类号： B32B15/04

CPC分类号： B32B15/04 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2933/0075 ,  H01L2924/00014

摘要： The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.

摘要翻译： 金属层压体及其制造方法技术领域本发明涉及金属层压体及使用其的发光二极管封装的制造方法。 本发明提供一种金属层压体，其包括：由绝缘材料制成的芯层; 设置在所述芯层的一个表面上的金属层; 布置在所述芯层的另一个表面上的散热金属层; 以及沿着散热金属层的外表面设置并由散热金属层的氧化物构成的保护性金属氧化物层。

公开(公告)号：US20110266038A1

公开(公告)日：2011-11-03

申请号：US12911627

申请日：2010-10-25

申请人： Kye Won CHOI ,  Da Hee JOUNG ,  Cheol Ho HEO ,  Myung Gun CHONG ,  Sung Jun LEE

发明人： Kye Won CHOI ,  Da Hee JOUNG ,  Cheol Ho HEO ,  Myung Gun CHONG ,  Sung Jun LEE

IPC分类号： H05K1/11 ,  H01K3/10 ,  H05K1/09

CPC分类号： H05K3/429 ,  H05K3/022 ,  H05K3/4046 ,  H05K2201/10409 ,  H05K2203/0178 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof.

摘要翻译： 这里公开了一种印刷电路板，包括：基板，其包括在其一侧形成的第一电路层和形成在其另一侧上的第二电路层; 以及外部插入到所述基板中并且电连接所述第一电路层和所述第二电路层的冲击型贯穿体。 印刷电路板的优点在于，由于冲击型贯通体被外部插入到基板中，因此可以省略诸如孔形成，去毛刺，去污，无电解镀铜和电解镀铜等常规复杂工艺，从而简化 制造印刷电路板的方法并降低其制造成本。