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17 条记录 (耗时 0.015 秒)

    PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20110266038A1

    公开(公告)日：2011-11-03

    申请号：US12911627

    申请日：2010-10-25

    申请人： Kye Won CHOI ,  Da Hee JOUNG ,  Cheol Ho HEO ,  Myung Gun CHONG ,  Sung Jun LEE

    发明人： Kye Won CHOI ,  Da Hee JOUNG ,  Cheol Ho HEO ,  Myung Gun CHONG ,  Sung Jun LEE

    IPC分类号： H05K1/11 ,  H01K3/10 ,  H05K1/09

    CPC分类号： H05K3/429 ,  H05K3/022 ,  H05K3/4046 ,  H05K2201/10409 ,  H05K2203/0178 ,  Y10T29/49165

    摘要： Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof.

    摘要翻译： 这里公开了一种印刷电路板，包括：基板，其包括在其一侧形成的第一电路层和形成在其另一侧上的第二电路层; 以及外部插入到所述基板中并且电连接所述第一电路层和所述第二电路层的冲击型贯穿体。 印刷电路板的优点在于，由于冲击型贯通体被外部插入到基板中，因此可以省略诸如孔形成，去毛刺，去污，无电解镀铜和电解镀铜等常规复杂工艺，从而简化 制造印刷电路板的方法并降低其制造成本。

    Heat radiating structure and method for manufacturing the same
    3.
    发明申请
    Heat radiating structure and method for manufacturing the same 审中-公开
    散热结构及其制造方法

    公开(公告)号：US20110100616A1

    公开(公告)日：2011-05-05

    申请号：US12656017

    申请日：2010-01-13

    申请人： Cheol Ho Heo

    发明人： Cheol Ho Heo

    IPC分类号： F28F7/00 ,  B05D5/00 ,  B32B38/10

    CPC分类号： H01L33/642 ,  H01L23/3677 ,  H01L23/498 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a heat radiating structure including: a metal substrate having a front surface facing a light emitting device, a rear surface opposite to the front surface, and side surfaces connecting the front surface and the rear surface; an oxide film pattern covering the front surface of the metal substrate; an adhesive film covering the oxide film pattern; and a metal pattern formed on the adhesive film and having a heat transmission via bonded to the oxide film pattern through the adhesive film.

    摘要翻译： 本发明提供一种散热结构，其特征在于，包括：金属基板，具有面向发光元件的前表面，与所述前表面相对的后表面，以及连接前表面和后表面的侧表面; 覆盖金属基板的前表面的氧化物膜图案; 覆盖氧化膜图案的粘合膜; 以及金属图案，其形成在粘合膜上，并通过粘合剂膜与氧化膜图案接合而具有热传递性。

    Printed circuit board
    5.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US08624123B2

    公开(公告)日：2014-01-07

    申请号：US13102323

    申请日：2011-05-06

    申请人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    发明人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    IPC分类号： H05K1/00 ,  H05K7/20

    CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

    摘要： The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

    摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

    Heat radiating substrate and method of manufacturing the same
    6.
    发明申请
    Heat radiating substrate and method of manufacturing the same 审中-公开
    散热基板及其制造方法

    公开(公告)号：US20120085574A1

    公开(公告)日：2012-04-12

    申请号：US13064364

    申请日：2011-03-21

    申请人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

    发明人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

    IPC分类号： H05K1/14 ,  H05K3/42

    CPC分类号： H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

    摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

    摘要翻译： 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

    Light emitting device package and method for manufacturing the same
    8.
    发明申请
    Light emitting device package and method for manufacturing the same 审中-公开
    发光器件封装及其制造方法

    公开(公告)号：US20110101406A1

    公开(公告)日：2011-05-05

    申请号：US12654750

    申请日：2009-12-30

    申请人： Cheol Ho Heo ,  Dek Gin Yang ,  Myung Gun Chong

    发明人： Cheol Ho Heo ,  Dek Gin Yang ,  Myung Gun Chong

    IPC分类号： H01L33/00 ,  H01L21/50

    CPC分类号： H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a light emitting device package including: a light emitting device structure having a light emitting device and a lead frame connected to the light emitting device; and a heat radiating structure bonded to the light emitting device structure and radiating heat generated from the light emitting device, wherein the heat radiating structure includes a conductive substrate, an insulating pattern covering a front surface of the conductive substrate opposite to the light emitting device structure, and a metal pattern bonded to the conductive substrate and the lead frame.

    摘要翻译： 本发明提供了一种发光器件封装，包括：发光器件结构，其具有连接到发光器件的发光器件和引线框架; 以及散热结构，其结合到所述发光器件结构并且辐射从所述发光器件产生的热，其中所述散热结构包括导电衬底，覆盖所述导电衬底的与所述发光器件结构相对的前表面的绝缘图案 以及结合到导电基板和引线框架的金属图案。

    Printed circuit board and manufacturing method of the same
    9.
    发明申请
    Printed circuit board and manufacturing method of the same 审中-公开
    印刷电路板及其制造方法相同

    公开(公告)号：US20090133920A1

    公开(公告)日：2009-05-28

    申请号：US12216374

    申请日：2008-07-02

    申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Yun-Seok Hwang ,  Chan-Yeup Chung ,  Young-Ho Lee ,  Cheol-Ho Heo

    发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Yun-Seok Hwang ,  Chan-Yeup Chung ,  Young-Ho Lee ,  Cheol-Ho Heo

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/4641 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09554 ,  Y10T29/49165

    摘要： A printed circuit board and a manufacturing method of the same. The method includes forming a circuit board by selectively positioning a heat release layer among multiple insulation layers that have circuit patterns formed on their surfaces, perforating a through-hole that penetrates through one side and the other side of the circuit board, forming a metal film over the heat release layer exposed at an inner wall surface of the through-hole, and forming a plating layer by depositing a conductive metal over an inner wall of the through-hole. By having the heat release layer selectively inserted inside the circuit board, the heat releasing effect may be improved, and the bending strength may be increased. Moreover, a reliable electrical connection can be implemented between the heat release layer and the circuit pattern, making it possible to utilize the heat release layer as a power supply layer or a ground layer.

    摘要翻译： 一种印刷电路板及其制造方法。 该方法包括通过在其表面上形成有电路图案的多个绝缘层中选择性地定位放热层来形成电路板，穿透穿过电路板的一侧和另一侧的通孔，形成金属膜 在通孔的内壁表面露出的放热层上，通过在通孔的内壁上沉积导电金属而形成镀层。 通过使散热层选择性地插入电路板内，可以提高散热效果，并且可以提高弯曲强度。 此外，可以在散热层和电路图案之间实现可靠的电连接，使得可以将散热层用作电源层或接地层。