Abstract:
A method for fabricating a semiconductor device includes forming a gate insulation layer over a substrate, sequentially forming a silicon layer and a metal layer over the gate insulation layer, performing a first gate etching process to etch the metal layer using a gate hard mask layer, formed on the metal layer, as an etch barrier, and then partially etch the silicon layer, thereby forming a first pattern, performing a second gate etching process to partially etch the silicon layer, thereby forming an undercut beneath the metal layer, forming a capping layer on both sidewalls of the first pattern including the undercut, performing a third gate etching process to etch the silicon layer to expose the gate insulation layer using the gate hard mask layer and the capping layer as an etch barrier, thereby forming a second pattern, and performing a gate re-oxidation process.
Abstract:
Example embodiments relate to a method of manufacturing a capacitor and a method of manufacturing a semiconductor device using the same. Other example embodiments relate to a method of manufacturing a capacitor having improved characteristics and a method of manufacturing a semiconductor device using the same. In a method of manufacturing a capacitor having improved characteristics, an insulation layer, including a pad therein, may be formed on a substrate. An etch stop layer may be formed on the insulation layer. A mold layer may be formed on the etch stop layer. The mold layer may be partially etched by a first etching process to form a first contact hole exposing the etch stop layer. The mold layer may be partially etched by a second etching process to form a second contact hole. The exposed etch stop layer may be etched by a third etching process to form a third contact hole exposing the pad. A native oxide layer on the exposed pad may be removed by a fourth etching process to form a capacitor contact hole. A conductive layer may be formed in the capacitor contact hole to form a capacitor.
Abstract:
Pixel arrays of an image sensor that include a first pixel and a second pixel adjacent the first pixel are provided. The first pixel may include a first photoelectric conversion device, a first charge storage device, a first floating diffusion node and a first transfer gate. The second pixel may include a second photoelectric conversion device, a second charge storage device, a second floating diffusion node and a second transfer gate. The pixel arrays may also include a storage gate on both the first charge storage device and the second charge storage device. The storage gate may have a unitary structure.
Abstract:
A liquid crystal display device includes: first and second substrates facing and spaced apart from each other, each of the first and second substrates having an image-displaying sub pixel and a viewing angle-adjusting sub pixel; a thin film transistor corresponding to each of the image-displaying sub pixel and the viewing angle-adjusting sub pixel; a liquid crystal display layer between the first and second substrates, the liquid crystal layer having a negative dielectric constant anisotropy; a first field distortion means in the image-displaying sub pixel; and a second field distortion means in the viewing angle-adjusting sub pixel.
Abstract:
A method for fabricating a semiconductor device is disclosed. One embodiment of the method includes forming a dummy gate pattern on a substrate, forming an interlayer dielectric film that covers the dummy gate pattern, exposing a top surface of the dummy gate pattern, selectively removing the dummy gate pattern to form a first gate trench, forming a sacrificial layer pattern over a top surface of the substrate in the first gate trench, the sacrificial layer pattern leaving a top portion of the first gate trench exposed, increasing an upper width of the exposed top portion of the first gate trench to form a second gate trench, and removing the sacrificial layer pattern in the second gate trench, and forming a non-dummy gate pattern in the second gate trench.
Abstract:
A liquid crystal display device includes: first and second substrates facing and spaced apart from each other, each of the first and second substrates having an image-displaying sub pixel and a viewing angle-adjusting sub pixel; a thin film transistor corresponding to each of the image-displaying sub pixel and the viewing angle-adjusting sub pixel; a liquid crystal display layer between the first and second substrates, the liquid crystal layer having a negative dielectric constant anisotropy; a first field distortion means in the image-displaying sub pixel; and a second field distortion means in the viewing angle-adjusting sub pixel.
Abstract:
A liquid crystal display device includes: first and second substrates facing and spaced apart from each other, each of the first and second substrates having an image-displaying sub pixel and a viewing angle-adjusting sub pixel; a thin film transistor corresponding to each of the image-displaying sub pixel and the viewing angle-adjusting sub pixel; a liquid crystal display layer between the first and second substrates, the liquid crystal layer having a negative dielectric constant anisotropy; a first field distortion means in the image-displaying sub pixel; and a second field distortion means in the viewing angle-adjusting sub pixel.
Abstract:
Provided are an apparatus for evaluating an indirect loss caused by a ubiquity effect by provision of a universal service, and a method thereof. The apparatus includes a first data storage unit for storing population statistics-related data, a second data storage unit for storing universal service offer-related data, a control unit for reading out and delivering required data from the first and second data storage units to a ubiquity loss calculation unit and controlling the ubiquity loss calculation unit, the ubiquity loss calculation unit for calculating a ubiquity loss of each evaluation object district by using the required data from the control unit, and a third data storage unit for storing the ubiquity loss of each evaluation object district calculated in the ubiquity loss calculation unit.
Abstract:
A liquid crystal display device includes: first and second substrates facing and spaced apart from each other, each of the first and second substrates having an image-displaying sub pixel and a viewing angle-adjusting sub pixel; a thin film transistor corresponding to each of the image-displaying sub pixel and the viewing angle-adjusting sub pixel; a liquid crystal display layer between the first and second substrates, the liquid crystal layer having a negative dielectric constant anisotropy; a first field distortion means in the image-displaying sub pixel; and a second field distortion means in the viewing angle-adjusting sub pixel.
Abstract:
A method for fabricating a semiconductor device includes forming a polysilicon layer, a barrier metal layer, and a conductive layer over a substrate, forming gate hard masks over the conductive layer, etching the conductive layer and the barrier metal layer using the gate hard masks to form barrier metal electrodes and metal gate electrodes having a line width smaller than that of the gate hard masks, etching the polysilicon layer to form gate patterns, each gate pattern including a stack structure of a polysilicon electrode, the barrier metal electrode, the metal gate electrode, and the gate hard mask, forming a gate spacer over the surface profile of the substrate structure, forming an insulation layer over the gate spacer, etching the insulation layer to form a contact hole between the gate patterns and burying a conductive material over the contact hole to form a landing plug contact.