Spin head, apparatus for treating substrate, and method for treating substrate
    1.
    发明授权
    Spin head, apparatus for treating substrate, and method for treating substrate 有权
    旋转头,处理基板的设备,以及处理基板的方法

    公开(公告)号:US08714169B2

    公开(公告)日:2014-05-06

    申请号:US12623582

    申请日:2009-11-23

    IPC分类号: B08B3/00

    摘要: Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.

    摘要翻译: 提供了支撑衬底并旋转衬底的旋转头。 旋转头包括主体,安装在主体上的卡盘销,并且在支撑基板的支撑位置和在提供用于装载/卸载基板的空间的等待位置之间移动的卡盘销以及配置成移动卡盘销的卡盘销移动单元。 卡盘销移动单元包括与每个卡盘销连接的旋转杆,将旋转杆固定到主体上的枢轴销和驱动构件,该旋转杆将旋转杆围绕枢转销旋转,以将卡盘销从 支持位置到等待位置。 当主体旋转时,旋转杆使用反向离心力将卡盘销从等待位置向支撑位置施加力。 卡盘销包括在过程中交替地卡住基板的第一销和第二销。

    Substrate supporting unit, and apparatus and method for polishing substrate using the same
    2.
    发明授权
    Substrate supporting unit, and apparatus and method for polishing substrate using the same 有权
    基板支撑单元,以及使用其的抛光基板的装置和方法

    公开(公告)号:US08382555B2

    公开(公告)日:2013-02-26

    申请号:US12591246

    申请日:2009-11-13

    申请人: Taek Youb Lee

    发明人: Taek Youb Lee

    IPC分类号: B24B1/00

    摘要: Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the substrate is upwardly spaced from the substrate supporting unit to clean the substrate during a post-cleaning process. Therefore, in the substrate supporting unit and the apparatus and method for polishing the substrate using the same, a polishing process on a top surface of the substrate and a post-cleaning process on the top and bottom surfaces of the substrate may be sequentially performed in a state where the substrate is supported by a single wafer type substrate supporting unit.

    摘要翻译: 提供了一种基板支撑单元以及使用该基板支撑单元抛光基板的装置和方法。 衬底支撑单元在抛光过程期间吸收衬底的底表面,并且在衬底与衬底支撑单元向上间隔开的状态下支撑衬底,以在后清洗过程中清洁衬底。 因此,在基板支撑单元以及使用其的基板的抛光装置和方法中,可以在基板的上表面上的研磨处理和基板的顶面和底面上的后清洗处理顺序地进行 基板由单晶片型基板支撑单元支撑的状态。

    Substrate chucking member, substrate processing, apparatus having the member, and method of processing substrate using the member
    3.
    发明申请
    Substrate chucking member, substrate processing, apparatus having the member, and method of processing substrate using the member 有权
    基板夹紧构件,基板处理,具有该构件的装置以及使用该构件处理基板的方法

    公开(公告)号:US20100130020A1

    公开(公告)日:2010-05-27

    申请号:US12591624

    申请日:2009-11-25

    IPC分类号: H01L21/465

    摘要: A substrate chucking member includes a substrate supporting member and a rotation adjustment unit. The supporting member includes a rotatable supporting plate to load a substrate, and chucking pins disposed at the supporting plate for spacing the substrate off the top of the supporting plate by supporting the edge of the substrate from a side of the substrate. Each of the chucking pins is rotatable for rotating the substrate supported on the chucking pins. The rotation adjustment unit is disposed under the supporting plate for adjusting rotation of the chucking pins. During a process, since a substrate is rotated by the chucking pins to vary points of the substrate making contact with the chucking pins, positions of the substrate where a process liquid falls after colliding with the chucking pins can be continuously varied. Therefore, the substrate can be processed without defects at an end part of the substrate.

    摘要翻译: 基板夹持构件包括基板支撑构件和旋转调节单元。 支撑构件包括用于装载基板的可旋转支撑板和设置在支撑板处的夹持销,用于通过从基板的侧面支撑基板的边缘来将基板从支撑板的顶部隔开。 每个夹紧销可旋转以旋转支撑在夹紧销上的基板。 旋转调节单元设置在支撑板下方,用于调节夹紧销的旋转。 在处理过程中,由于基板通过夹紧销旋转以改变与夹紧销接触的基板的位置,所以在与夹紧销碰撞之后处理液体落下的基板的位置可以连续变化。 因此,可以在基板的端部处对基板进行无缺陷地加工。

    Substrate supporting unit, and apparatus and method for polishing substrate using the same
    4.
    发明申请
    Substrate supporting unit, and apparatus and method for polishing substrate using the same 有权
    基板支撑单元,以及使用其的抛光基板的装置和方法

    公开(公告)号:US20100130105A1

    公开(公告)日:2010-05-27

    申请号:US12591246

    申请日:2009-11-13

    申请人: Taek Youb Lee

    发明人: Taek Youb Lee

    IPC分类号: B24B7/20 B24B1/00 B24B41/06

    摘要: Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the substrate is upwardly spaced from the substrate supporting unit to clean the substrate during a post-cleaning process. Therefore, in the substrate supporting unit and the apparatus and method for polishing the substrate using the same, a polishing process on a top surface of the substrate and a post-cleaning process on the top and bottom surfaces of the substrate may be sequentially performed in a state where the substrate is supported by a single wafer type substrate supporting unit.

    摘要翻译: 提供了一种基板支撑单元以及使用该基板支撑单元抛光基板的装置和方法。 衬底支撑单元在抛光过程期间吸收衬底的底表面,并且在衬底与衬底支撑单元向上间隔开的状态下支撑衬底,以在后清洗过程中清洁衬底。 因此,在基板支撑单元以及使用其的基板的抛光装置和方法中,可以在基板的上表面上的研磨处理和基板的顶面和底面上的后清洗处理顺序地进行 基板由单晶片型基板支撑单元支撑的状态。

    Spin head and method of chucking substrate using the same
    5.
    发明授权
    Spin head and method of chucking substrate using the same 有权
    旋转头和使用其夹持底物的方法

    公开(公告)号:US08394234B2

    公开(公告)日:2013-03-12

    申请号:US12591247

    申请日:2009-11-13

    申请人: Taek Youb Lee

    发明人: Taek Youb Lee

    IPC分类号: H01L21/465

    摘要: Provided is a spin head. Chuck pins, installed at a support plate to support the lateral surface of a substrate, are moved along the perpendicular direction to the radial direction of the support plate. The effect of centrifugal force applied to the chuck pins during the rotation of the support plate is minimized to support a substrate stably.

    摘要翻译: 提供一个旋转头。 安装在支撑板上以支撑基板的侧表面的卡盘销沿着与支撑板的径向的垂直方向移动。 在支撑板旋转期间施加到卡盘销的离心力的作用被最小化以稳定地支撑基板。

    Spin head and method of chucking substrate using the same
    6.
    发明申请
    Spin head and method of chucking substrate using the same 有权
    旋转头和使用其夹持底物的方法

    公开(公告)号:US20100126962A1

    公开(公告)日:2010-05-27

    申请号:US12591247

    申请日:2009-11-13

    申请人: Taek Youb Lee

    发明人: Taek Youb Lee

    IPC分类号: C23F1/00 C23F1/08

    摘要: Provided is a spin head. Chuck pins, installed at a support plate to support the lateral surface of a substrate, are moved along the perpendicular direction to the radial direction of the support plate. The effect of centrifugal force applied to the chuck pins during the rotation of the support plate is minimized to support a substrate stably.

    摘要翻译: 提供一个旋转头。 安装在支撑板上以支撑基板的侧表面的卡盘销沿着与支撑板的径向的垂直方向移动。 在支撑板旋转期间施加到卡盘销的离心力的作用被最小化以稳定地支撑基板。

    Substrate chucking member, substrate processing apparatus having the member, and method of processing substrate using the member
    7.
    发明授权
    Substrate chucking member, substrate processing apparatus having the member, and method of processing substrate using the member 有权
    基板夹紧构件,具有构件的基板处理装置以及使用该构件处理基板的方法

    公开(公告)号:US08435380B2

    公开(公告)日:2013-05-07

    申请号:US12591624

    申请日:2009-11-25

    IPC分类号: H01L21/465

    摘要: A substrate chucking member includes a substrate supporting member and a rotation adjustment unit. The supporting member includes a rotatable supporting plate to load a substrate, and chucking pins disposed at the supporting plate for spacing the substrate off the top of the supporting plate by supporting the edge of the substrate from a side of the substrate. Each of the chucking pins is rotatable for rotating the substrate supported on the chucking pins. The rotation adjustment unit is disposed under the supporting plate for adjusting rotation of the chucking pins. During a process, since a substrate is rotated by the chucking pins to vary points of the substrate making contact with the chucking pins, positions of the substrate where a process liquid falls after colliding with the chucking pins can be continuously varied. Therefore, the substrate can be processed without defects at an end part of the substrate.

    摘要翻译: 基板夹持构件包括基板支撑构件和旋转调节单元。 支撑构件包括用于装载基板的可旋转支撑板和设置在支撑板处的夹持销,用于通过从基板的侧面支撑基板的边缘来将基板从支撑板的顶部隔开。 每个夹紧销可旋转以旋转支撑在夹紧销上的基板。 旋转调节单元设置在支撑板下方,用于调节夹紧销的旋转。 在处理过程中,由于基板通过夹紧销旋转以改变与夹紧销接触的基板的位置,所以在与夹紧销碰撞之后处理液体落下的基板的位置可以连续变化。 因此,可以在基板的端部处对基板进行无缺陷地加工。