Method for selectively scaling a field emission electron gun and device
formed thereby
    1.
    发明授权
    Method for selectively scaling a field emission electron gun and device formed thereby 失效
    用于选择性地缩放由其形成的场致发射电子枪和装置的方法

    公开(公告)号:US5155412A

    公开(公告)日:1992-10-13

    申请号:US706035

    申请日:1991-05-28

    IPC分类号: G01Q60/10 H01J3/02

    CPC分类号: B82Y15/00 H01J3/021

    摘要: The present invention is directed to a method for selectively scaling the dimensions of a field emission electron gun. The electron gun includes a field emission tip followed by a dual electrode immersion lens. The lens consists of two planar electrodes separated by a dielectric layer. A well defined circular hole is present at the center of each electrode and the dielectric layer. A high scaling factor is applied to the region consisting of the first electrode and the emission tip, reducing the first electrode thickness and bore diameter and the distance between the tip and first electrode to the micrometer range. A weaker scaling factor is applied to the bore diameter of the second electrode and the spacing between the electrodes such that the second electrode bore diameter and distance between the electrodes are approximately equal and are greater than the first electrode thickness and bore diameter and the distance between the tip and first electrode.

    摘要翻译: 本发明涉及一种用于选择性地缩放场致发射电子枪尺寸的方法。 电子枪包括场发射尖端,后面是双电极浸没透镜。 该透镜由两层由电介质层隔开的平面电极组成。 在每个电极和电介质层的中心存在明确的圆形孔。 将高比例因子应用于由第一电极和发射尖端组成的区域,将第一电极厚度和孔直径以及尖端和第一电极之间的距离减小到微米范围。 将较小的比例因子应用于第二电极的孔径和电极之间的间隔,使得第二电极孔直径和电极之间的距离近似相等并且大于第一电极厚度和孔直径以及第二电极之间的距离 尖端和第一电极。

    Method for correcting proximity effects in electron beam lithography
    3.
    发明授权
    Method for correcting proximity effects in electron beam lithography 失效
    用于校正电子束光刻中邻近效应的方法

    公开(公告)号:US5051598A

    公开(公告)日:1991-09-24

    申请号:US580979

    申请日:1990-09-12

    CPC分类号: H01J37/3026

    摘要: A proximity effect correction method for electron beam lithography suitable for high voltages and/or very dense patterns applies both backscatter and forward scatter dose corrections. Backscatter dose corrections are determined by computing two matrices, a "Proximity Matrix" P and a "Fractional Density Matrix" F. The Proximity Matrix P is computed using known algorithms. The elements of the Fractional Density Matrix are the fractional shape coverage in a mesh of square cells which is superimposed on a pattern of interest. Then, a Dose Correction Matrix D is computed by convolving the P and F matrices. The final backscatter dose corrections are assigned to each shape either as area-weighted averages of the D matrix elements for all cells spanned by the shape, or by polynomial or other interpolation of the dose correction field defined by the D matrix. The D matrix also provides a basis for automatic shape fracturing for optimal proximity correction. Optionally, forward scattering correction may be included in the correction process. Forward scattering correction consists of boosting the dose applied to shape i by a factor b.sub.i. These boost factors are computed in a separate and independent step which considers only forward scattering. They are combined with those resulting from the backscatter correction scheme either by simple multiplication to form the final correction factors, or by inputting them to the backscatter correction scheme as numerical weights for each shape.