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公开(公告)号:US20120103087A1
公开(公告)日:2012-05-03
申请号:US13070131
申请日:2011-03-23
IPC分类号: G01F3/00
CPC分类号: G01F1/6842 , G01F1/6845 , G01F15/14
摘要: The flow rate detection device includes a sensor element and a support. The sensor element includes: a cavity which is formed in a rear surface of a plate-shaped semiconductor silicon substrate by removing part of the plate-shaped semiconductor silicon substrate; and a thin film portion which is disposed over the cavity and includes a detecting element. The support includes a fitting portion into which the sensor element is to be disposed. The sensor element is supported to the fitting portion by an adhesive in a floating manner. A gap formed between the sensor element and the fitting portion is filled with an anti-undercurrent material. The sensor element has a texture including protrusions and depressions formed on a surface opposed to the fitting portion, and the anti-undercurrent material is brought into contact with the texture.
摘要翻译: 流量检测装置包括传感器元件和支撑件。 传感器元件包括:通过去除板状半导体硅衬底的一部分而形成在板状半导体硅衬底的后表面中的空腔; 以及设置在空腔上方并包括检测元件的薄膜部分。 该支撑件包括一个装配部分,传感器元件将被放置在其中。 传感器元件通过粘合剂以浮动方式支撑到配合部分。 传感器元件与嵌合部之间形成的间隙填充有防止欠电流材料。 传感器元件具有包括在与配合部相对的表面上形成的突起和凹陷的纹理,并且防止欠电流材料与纹理接触。
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公开(公告)号:US20120286379A1
公开(公告)日:2012-11-15
申请号:US13204058
申请日:2011-08-05
申请人: Hiromoto INOUE
发明人: Hiromoto INOUE
IPC分类号: H01L29/84
CPC分类号: G01L9/0047 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C3/001 , B81C2201/019 , G01L9/0048 , G01L9/0054
摘要: A sensor element includes: a first substrate in which a diaphragm is configured on a main surface; a second substrate which is provided on the side opposite to the diaphragm of the first substrate; a cavity which is provided just below the diaphragm of the first substrate; a bonding position which is provided at a bonding position between the first substrate and the second substrate for airtight sealing of the cavity; and a bump portion which is provided at the fitting portion, and protects a fitted state between the first substrate and the second substrate.
摘要翻译: 传感器元件包括:第一基板,其中隔膜构造在主表面上; 第二基板,其设置在与所述第一基板的所述振膜相反的一侧; 设置在第一基板的隔膜正下方的空腔; 所述接合位置设置在所述第一基板和所述第二基板之间的接合位置,用于所述空腔的气密密封; 以及设置在所述装配部分处的凸起部分,并且保护所述第一基板和所述第二基板之间的装配状态。
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