公开(公告)号：US20120103087A1

公开(公告)日：2012-05-03

申请号：US13070131

申请日：2011-03-23

申请人： Taiki NAKANISHI ,  Hiromoto INOUE ,  Yoshitatsu KAWAMA

发明人： Taiki NAKANISHI ,  Hiromoto INOUE ,  Yoshitatsu KAWAMA

IPC分类号： G01F3/00

CPC分类号： G01F1/6842 ,  G01F1/6845 ,  G01F15/14

摘要： The flow rate detection device includes a sensor element and a support. The sensor element includes: a cavity which is formed in a rear surface of a plate-shaped semiconductor silicon substrate by removing part of the plate-shaped semiconductor silicon substrate; and a thin film portion which is disposed over the cavity and includes a detecting element. The support includes a fitting portion into which the sensor element is to be disposed. The sensor element is supported to the fitting portion by an adhesive in a floating manner. A gap formed between the sensor element and the fitting portion is filled with an anti-undercurrent material. The sensor element has a texture including protrusions and depressions formed on a surface opposed to the fitting portion, and the anti-undercurrent material is brought into contact with the texture.

摘要翻译： 流量检测装置包括传感器元件和支撑件。 传感器元件包括：通过去除板状半导体硅衬底的一部分而形成在板状半导体硅衬底的后表面中的空腔; 以及设置在空腔上方并包括检测元件的薄膜部分。 该支撑件包括一个装配部分，传感器元件将被放置在其中。 传感器元件通过粘合剂以浮动方式支撑到配合部分。 传感器元件与嵌合部之间形成的间隙填充有防止欠电流材料。 传感器元件具有包括在与配合部相对的表面上形成的突起和凹陷的纹理，并且防止欠电流材料与纹理接触。

公开(公告)号：US20070137310A1

公开(公告)日：2007-06-21

申请号：US11279606

申请日：2006-04-13

申请人： Hideki YABE ,  Yuichi SAKAI ,  Yoshitatsu KAWAMA ,  Munehito KUMAGAI ,  Yasuyuki NAKAOKA

发明人： Hideki YABE ,  Yuichi SAKAI ,  Yoshitatsu KAWAMA ,  Munehito KUMAGAI ,  Yasuyuki NAKAOKA

IPC分类号： G01N3/00

CPC分类号： G01N3/08 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0282 ,  G01N2203/0647

摘要： A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.

摘要翻译： 在其上设置有多个具有膜片部分的传感器芯片的半导体晶片上执行传感器芯片断裂强度检查的传感器芯片断裂强度检查装置包括：安装半导体晶片的台阶; 以及以与传感器芯片的标准断裂强度相当的压力将介质发射到传感器芯片上的喷嘴。