Abstract:
A polyimide film arrangement (e.g., a polyimide film) includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer and containing a polyimide. The polyimide layer or the base layer includes a filler having a surface energy less than about 35 dyne/cm. Moreover, the present application also describes a method of fabricating the polyimide film arrangement, and its assembly on a substrate.