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1.发明授权公开(公告)号：US10040939B2
公开(公告)日：2018-08-07
申请号：US14697185
申请日：2015-04-27
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chun-Ting Lai , Chih-Wei Lin
IPC: C08L79/08 , C08J5/18 , C09D179/08 , C08G73/10
Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.
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公开(公告)号：US09839136B2
公开(公告)日：2017-12-05
申请号：US15250595
申请日：2016-08-29
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Paul S. C. Wu , Chun-Ting Lai , Yen-Po Huang , Sheng-Yu Huang
CPC classification number: H05K3/007 , H05K3/022 , H05K3/281 , H05K2201/0154 , H05K2203/0264
Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.
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公开(公告)号：US20160059527A1
公开(公告)日：2016-03-03
申请号：US14839655
申请日：2015-08-28
Applicant: Taimide Technology Incorporation
Inventor： Chun-Ting Lai , Chih-Wei Lin
CPC classification number: B32B27/281 , B32B7/00 , B32B7/02 , B32B7/06 , B32B27/06 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/28 , B32B2250/00 , B32B2250/24 , B32B2250/40 , B32B2264/00 , B32B2264/0242 , B32B2307/20 , B32B2307/204 , B32B2307/748 , B32B2457/00 , B32B2457/08 , C08L79/08 , C09D179/08
Abstract: A polyimide film includes a first sub-layer and a second sub-layer connected with each other. The first sub-layer contains a first polyimide, and a particulate filler of fluorine-containing polymer distributed in the first polyimide. The second sub-layer includes a second polyimide similar or identical to the first polyimide. The first polyimide is derived from a first diamine component and a first dianhydride component, the first diamine component and/or the first dianhydride component containing fluorine atoms. The second sub-layer is derived from a second diamine component and a second dianhydride component, the second diamine component and/or the second dianhydride component also containing fluorine atoms.
Abstract translation: 聚酰亚胺膜包括彼此连接的第一子层和第二子层。 第一子层包含第一聚酰亚胺和分散在第一聚酰亚胺中的含氟聚合物的颗粒填料。 第二子层包括与第一聚酰亚胺相似或相同的第二聚酰亚胺。 第一聚酰亚胺衍生自第一二胺组分和第一二酐组分，第一二胺组分和/或含有氟原子的第一二酐组分。 第二子层衍生自第二二胺组分和第二二酐组分，第二二胺组分和/或第二二酐组分也含有氟原子。
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Patent Agency Ranking
4.发明申请POLYIMIDE FILM HAVING A LOW DIELECTRIC CONSTANT AND A LOW GLOSS, AND METHOD OF FABRICATING THE SAME 审中-公开具有低介电常数和低玻璃的聚酰亚胺膜及其制造方法公开(公告)号：US20150307709A1
公开(公告)日：2015-10-29
申请号：US14697185
申请日：2015-04-27
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chun-Ting Lai , Chih-Wei Lin
CPC classification number: C08L79/08 , C08G73/1039 , C08G73/1042 , C08G73/1053 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08J2427/12 , C08J2427/18 , C08K3/04 , C08L27/12 , C08L27/18 , C09D179/08
Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.
Abstract translation: 聚酰亚胺膜包括聚酰亚胺，存在量为约0.5重量％至约5重量％之间的炭黑和以约15重量％至约40重量％存在的含氟聚合物。 聚酰亚胺膜可以是单层膜或多层膜，并且具有低介电常数和低光泽度。
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公开(公告)号：US20170298249A1
公开(公告)日：2017-10-19
申请号：US15131990
申请日：2016-04-18
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chih-Wei Lin , Chun-Ting Lai , Yen-Po Huang
IPC: C09D179/08
CPC classification number: C09D179/08 , C08G73/1042 , C08G73/105 , C08G73/106
Abstract: The present disclosure relates, according to some embodiments, to a multilayered polyimide film comprising a peelable base layer, and a polyimide layer adhered in contact with the peelable base layer. A peelable base layer may be derived from a reaction comprising a diamine compound and a dianhydride compound, wherein the peelable base comprises a polyimide and a structure according to formula (I): wherein n is a number of repeating units. According to some embodiments, a quantity of silicon atoms present in a peelable base layer comprises about 1% to about 12% of a total weight of the peelable base layer.
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公开(公告)号：US20170064838A1
公开(公告)日：2017-03-02
申请号：US15250595
申请日：2016-08-29
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Paul S.C. Wu , Chun-Ting Lai , Yen-Po Huang , Sheng-Yu Huang
CPC classification number: H05K3/007 , H05K3/022 , H05K3/281 , H05K2201/0154 , H05K2203/0264
Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.
Abstract translation: 根据一些实施例，本公开涉及柔性电路板的制造，其包括形成包含聚酰亚胺的基层，在基层上形成聚酰亚胺层，所述聚酰亚胺层具有第一表面和与第二表面相对的第二表面 彼此之间，第一表面可剥离地与基底层接触，在聚酰亚胺层的第二表面上形成金属层，并且在聚酰亚胺层上剥离基底层，金属层残留在聚酰亚胺的第二表面上 层。
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公开(公告)号：US11732160B2
公开(公告)日：2023-08-22
申请号：US17106211
申请日：2020-11-30
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chun-Chi Hsu , Chun-Ting Lai , Chih-Wei Lin
CPC classification number: C09J7/38 , C09J7/25 , C09J7/383 , C09J7/385 , H01L33/0095 , C09J2203/326 , C09J2301/1242 , C09J2301/312 , C09J2433/00 , C09J2479/086
Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.
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公开(公告)号：US20160060404A1
公开(公告)日：2016-03-03
申请号：US14839654
申请日：2015-08-28
Applicant: Taimide Technology Incorporation
Inventor： Chih-Wei Lin , Chun-Ting Lai , Yen-Po HUANG
CPC classification number: B32B27/281 , B29D7/01 , B32B3/10 , B32B7/12 , B32B15/08 , B32B27/20 , B32B37/144 , B32B38/10 , B32B2255/10 , B32B2255/26 , B32B2260/02 , B32B2264/0242 , B32B2307/518 , B32B2379/08 , B32B2457/08 , H05K3/281
Abstract: A polyimide film arrangement (e.g., a polyimide film) includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer and containing a polyimide. The polyimide layer or the base layer includes a filler having a surface energy less than about 35 dyne/cm. Moreover, the present application also describes a method of fabricating the polyimide film arrangement, and its assembly on a substrate.
Abstract translation: 聚酰亚胺膜布置（例如，聚酰亚胺膜）包括具有彼此相反的第一和第二表面的聚酰亚胺层和可剥离地粘附到聚酰亚胺层的第一表面并含有聚酰亚胺的基层。 聚酰亚胺层或基层包括表面能小于约35达因/厘米的填料。 此外，本申请还描述了一种制造聚酰亚胺膜装置的方法及其在基板上的组装。
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