公开(公告)号：US20120091573A1

公开(公告)日：2012-04-19

申请号：US13112385

申请日：2011-05-20

申请人： Taishi SASAKI ,  Tsuyoshi TAKAYAMA ,  Mikio ISHIHARA

发明人： Taishi SASAKI ,  Tsuyoshi TAKAYAMA ,  Mikio ISHIHARA

IPC分类号： H01L23/34

CPC分类号： H01L23/3107 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.

摘要翻译： 提供了一种包括散热片的半导体器件; 绝缘片与所述散热片的上表面接合，所述上表面的一部分露出; 位于绝缘片上的散热器; 位于散热器上的功率元件; 以及覆盖包括散热片，绝缘片，散热器和功率元件的上表面的一部分的预定表面的传递模塑树脂，其中散热片的上表面具有突出形状，并且 /或凹形形状，以便结合绝缘片的边缘。

公开(公告)号：US20110221076A1

公开(公告)日：2011-09-15

申请号：US12907468

申请日：2010-10-19

申请人： Tsuyoshi TAKAYAMA ,  Yukio Yasuda ,  Hajime Katou ,  Kazuaki Hiyama ,  Taishi Sasaki ,  Mikio Ishihara

发明人： Tsuyoshi TAKAYAMA ,  Yukio Yasuda ,  Hajime Katou ,  Kazuaki Hiyama ,  Taishi Sasaki ,  Mikio Ishihara

IPC分类号： H01L23/48

CPC分类号： H01L23/142 ,  H01L23/492 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.

摘要翻译： 根据本发明的半导体器件包括：作为半导体元件的功率半导体元件; 用于接合半导体元件的上表面和下表面的接合部分; 以及通过所述接合部从上下接合到所述功率半导体元件的金属板，其中所述接合部包括设置在所述半导体元件和所述金属板之间的网状金属体以及嵌入所述网状金属体的接合构件。

公开(公告)号：US20090204568A1

公开(公告)日：2009-08-13

申请号：US12364111

申请日：2009-02-02

申请人： Tsuyoshi TAKAYAMA ,  Akihiro Shibata

发明人： Tsuyoshi TAKAYAMA ,  Akihiro Shibata

IPC分类号： G06F7/06 ,  G06F17/30

CPC分类号： G11B27/36 ,  G11B27/11 ,  G11B27/329 ,  G11B2220/65

摘要： When an external recording medium connected to an interface is removed therefrom and a new external recording medium is connected to the interface, a processor selects either first file analysis information read from a memory or second file analysis information generated based on analysis of data recorded on the new external recording medium as file analysis information to be used for decoding a file stored in the new external recording medium, and the processor makes such selection based on comparison between first recording medium management information and second recording medium management information.

摘要翻译： 当连接到接口的外部记录介质被移除并且新的外部记录介质被连接到接口时，处理器选择从存储器读取的第一文件分析信息或基于记录在存储器上的数据的分析生成的第二文件分析信息 新的外部记录介质作为用于解码存储在新的外部记录介质中的文件的文件分析信息，并且处理器基于第一记录介质管理信息和第二记录介质管理信息之间的比较来进行这样的选择。