公开(公告)号：US20230386887A1

公开(公告)日：2023-11-30

申请号：US18231751

申请日：2023-08-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M.C. Lin ,  C.C. Chien ,  Hsuan Lee ,  Boris Huang

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L22/34 ,  H01L21/02043 ,  H01L2221/68327

摘要： A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.