公开(公告)号：US11764097B2

公开(公告)日：2023-09-19

申请号：US17308786

申请日：2021-05-05

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M. C. Lin ,  C. C. Chien ,  Hsuan Lee ,  Boris Huang

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC分类号： H01L21/6836 ,  H01L21/02043 ,  H01L21/304 ,  H01L22/34 ,  H01L2221/68327

摘要： A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

公开(公告)号：US20230386887A1

公开(公告)日：2023-11-30

申请号：US18231751

申请日：2023-08-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M.C. Lin ,  C.C. Chien ,  Hsuan Lee ,  Boris Huang

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L22/34 ,  H01L21/02043 ,  H01L2221/68327

摘要： A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.