专利检索 ap:("Taiwan Semiconductor Manufacturing Co., Ltd.") AND inv:"Che-Wei Wu" 第 1 页

1.

发明授权
Method and system for adjusting location of a wafer and a top plate in a thin-film deposition process 有权

公开(公告)号：US12014910B2

公开(公告)日：2024-06-18

申请号：US17494553

申请日：2021-10-05

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yu-Hsiang Cheng , Che-Wei Wu

IPC分类号： C23C16/52 , H01J37/32

CPC分类号： H01J37/32926 , C23C16/52 , H01J37/32733 , H01J37/32981 , H01J2237/3321

摘要： A thin-film deposition system includes a top plate positioned above a wafer and configured to generate a plasma during a thin-film deposition process. The system includes a sensor configured to generate sensor signals indicative of a lifetime of a component of the thin-film deposition system, a characteristic of a thin-film deposited by the thin-film deposition system or a characteristic of a process material that flows into the thin-film deposition system. The system includes a control system configured to adjust a relative location of a top plate of the thin-film deposition system with respect to a location of a wafer in the thin-film deposition system during the thin-film deposition process responsive to the sensor signals.