公开(公告)号：US11980920B2

公开(公告)日：2024-05-14

申请号：US17212925

申请日：2021-03-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei Chang Cheng ,  Cheng-Kuang Chen ,  Chi-Hung Liao

IPC: B08B9/04 ,  C23C16/44 ,  H01L21/67

CPC classification number: B08B9/04 ,  C23C16/4407 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6715

Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.

公开(公告)号：US20180345334A1

公开(公告)日：2018-12-06

申请号：US15610082

申请日：2017-05-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei Chang Cheng ,  Cheng-Kuang Chen ,  Chi-Hung Liao

IPC: B08B9/027 ,  B08B3/08 ,  B05C11/08 ,  B05C9/08 ,  H01L21/027

Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.

公开(公告)号：US10987706B2

公开(公告)日：2021-04-27

申请号：US16803452

申请日：2020-02-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei Chang Cheng ,  Cheng-Kuang Chen ,  Chi-Hung Liao

IPC: B08B9/04 ,  H01L21/67 ,  C23C16/44

Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.