公开(公告)号：US20240181598A1

公开(公告)日：2024-06-06

申请号：US18438148

申请日：2024-02-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung LAI ,  Cheng-Ping CHEN ,  Shih-Chung CHEN ,  Sheng-Tai PENG

IPC: B24B37/30 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67 ,  H01L21/677

CPC classification number: B24B37/30 ,  B24B37/042 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67742

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.