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公开(公告)号：US20210118665A1
公开(公告)日：2021-04-22
申请号：US17114178
申请日：2020-12-07
发明人： Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
IPC分类号： H01L21/02 , H01L21/66 , G01B11/24 , G01N33/00 , H01L21/673 , H01L21/677 , B23P6/00
摘要： An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.
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公开(公告)号：US10464583B2
公开(公告)日：2019-11-05
申请号：US15645980
申请日：2017-07-10
发明人： Shih-Hung Chien , Jen-Ti Wang , Fu-Hsien Li , Chih-Hung Liu , Yung-Lin Hsu
摘要： A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.
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公开(公告)号：US20230191619A1
公开(公告)日：2023-06-22
申请号：US18170962
申请日：2023-02-17
发明人： Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
CPC分类号： B25J11/008 , G01B11/306 , H01L21/67005 , H01L21/0201
摘要： A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.
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公开(公告)号：US11605553B2
公开(公告)日：2023-03-14
申请号：US17099734
申请日：2020-11-16
发明人： Fu-Hsien Li , Chi-Feng Tung , Chi Yuan Chu , Jen-Ti Wang , Hsiang Yin Shen
IPC分类号： B65B69/00 , H01L21/67 , H01L21/683
摘要： An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
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公开(公告)号：US10861692B2
公开(公告)日：2020-12-08
申请号：US15794352
申请日：2017-10-26
发明人： Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
IPC分类号： H01L21/02 , G01N33/00 , B23P6/00 , H01L21/66 , G01B11/24 , H01L21/673 , H01L21/677 , B25J18/00 , B25J1/04
摘要： A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.
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公开(公告)号：US11426965B2
公开(公告)日：2022-08-30
申请号：US16943865
申请日：2020-07-30
发明人： Szu-Chen Huang , Fu-Hsien Li , Mao-Jung Chiu , Mao-Shun Lien , Po-Hsien Chiu
IPC分类号： B31B50/00 , B31B50/02 , B31B50/07 , B31B50/52 , B31B100/00
摘要： An apparatus and method for expanding a box blank into a box, the apparatus comprising an arm assembly, a controller, a camera and a box blank conveyor. The arm assembly includes a folding arm having a position in a first direction and a rotational angle controlled by the controller based on a position of a feature of the box blank in the field of view of the camera. The camera captures images of the box blank which are used to position the arm assembly and to evaluate the need to reject a box blank.
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公开(公告)号：US11001442B2
公开(公告)日：2021-05-11
申请号：US16893409
申请日：2020-06-04
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04 , H01L21/677
摘要： A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.
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公开(公告)号：US11584019B2
公开(公告)日：2023-02-21
申请号：US17114178
申请日：2020-12-07
发明人： Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
IPC分类号： B25J11/00 , G01B11/30 , H01L21/67 , H01L21/02 , H01L21/66 , B25J18/00 , G01B11/24 , G01N33/00 , H01L21/673 , H01L21/677 , B23P6/00 , B25J1/04
摘要： An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.
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公开(公告)号：US20200299060A1
公开(公告)日：2020-09-24
申请号：US16893409
申请日：2020-06-04
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04 , H01L21/677
摘要： A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.
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公开(公告)号：US20190131119A1
公开(公告)日：2019-05-02
申请号：US15794352
申请日：2017-10-26
发明人： Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
IPC分类号： H01L21/02 , H01L21/66 , H01L21/673 , G01B11/24 , G01N33/00
摘要： A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.
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