公开(公告)号：US11569099B2

公开(公告)日：2023-01-31

申请号：US17125191

申请日：2020-12-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Otto Chen ,  Chia-Chih Chen

IPC: F25B21/00 ,  H01L21/67 ,  H01L21/687 ,  F25B21/04

Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.

公开(公告)号：US11581169B2

公开(公告)日：2023-02-14

申请号：US16704858

申请日：2019-12-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Otto Chen ,  Chi-Ying Wu ,  Chia-Chih Chen

IPC: H01J37/32 ,  H01J37/244

Abstract: An ion collector includes a plurality of segments and a plurality of integrators. The plurality of segments are physically separated from one another and spaced around a substrate support. Each of the segments includes a conductive element that is designed to conduct a current based on ions received from a plasma. Each of the plurality of integrators is coupled to a corresponding conductive element. Each of the plurality of integrators is designed to determine an ion distribution for a corresponding conductive element based, at least in part, on the current conducted at the corresponding conductive element. An example benefit of this embodiment includes the ability to determine how uniform the ion distribution is across a wafer being processed by the plasma.

公开(公告)号：US20210104419A1

公开(公告)日：2021-04-08

申请号：US17125191

申请日：2020-12-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Otto CHEN ,  Chia-Chih Chen

IPC: H01L21/67 ,  H01L21/687 ,  F25B21/04

Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.

公开(公告)号：US11996276B2

公开(公告)日：2024-05-28

申请号：US18168362

申请日：2023-02-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Otto Chen ,  Chi-Ying Wu ,  Chia-Chih Chen

IPC: H01J37/32 ,  H01J37/244

CPC classification number: H01J37/32935 ,  H01J37/244 ,  H01J37/32146 ,  H01J37/32155 ,  H01J37/32449 ,  H01J37/3266 ,  H01J2237/24405 ,  H01J2237/24465 ,  H01J2237/24507 ,  H01J2237/24564

Abstract: An ion collector includes a plurality of segments and a plurality of integrators. The plurality of segments are physically separated from one another and spaced around a substrate support. Each of the segments includes a conductive element that is designed to conduct a current based on ions received from a plasma. Each of the plurality of integrators is coupled to a corresponding conductive element. Each of the plurality of integrators is designed to determine an ion distribution for a corresponding conductive element based, at least in part, on the current conducted at the corresponding conductive element. An example benefit of this embodiment includes the ability to determine how uniform the ion distribution is across a wafer being processed by the plasma.