公开(公告)号：US11685994B2

公开(公告)日：2023-06-27

申请号：US16570274

申请日：2019-09-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-chun Yang ,  Yi-Ming Lin ,  Chih-tsung Lee ,  Yun-Tzu Chiu ,  Chao-Hung Wan

IPC: C23C16/44 ,  C23C16/458 ,  C23C16/50 ,  C23C16/455

CPC classification number: C23C16/4412 ,  C23C16/4583 ,  C23C16/45565 ,  C23C16/50

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.