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公开(公告)号：US10947414B2
公开(公告)日：2021-03-16
申请号：US16503255
申请日：2019-07-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Fang-I Chih , Chih-Chieh Chang , Hui-Chi Huang , Kei-Wei Chen
IPC: C09G1/02 , B24B37/20 , C09G1/04 , H01L21/306 , H01L21/321
Abstract: A polishing composition for a chemical mechanical polishing process includes abrasive particles, at least one chemical additive, and a non-aqueous solvent.
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