公开(公告)号：US09941131B1

公开(公告)日：2018-04-10

申请号：US15460580

申请日：2017-03-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Hung Lin ,  Hsiao-Yi Wang ,  Yen-Min Liao ,  Hsin-Jung Lu ,  Diau-Tang Huang

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  H01L21/306 ,  H01L21/687 ,  H01L23/544 ,  B08B3/04

CPC classification number: H01L21/30604 ,  B05B15/50 ,  G03F7/00 ,  H01L21/6715 ,  H01L21/681 ,  H01L23/544 ,  H01L2223/54426

Abstract: A method for applying developer over a semiconductor wafer is provided. The method includes moving a nozzle over the center of the semiconductor wafer. The nozzle extends across the semiconductor wafer. The method also includes rotating the semiconductor wafer by a dispensing rotation angle that is less than 180 degrees. The method further includes dispensing developer over the semiconductor wafer relative to alignment marks formed on the semiconductor wafer while the semiconductor wafer is rotated by the dispensing rotation angle.

公开(公告)号：US09601436B2

公开(公告)日：2017-03-21

申请号：US14297889

申请日：2014-06-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Shing-Kuei Lai ,  Wei-Yueh Tseng ,  Hsiao-Yi Wang ,  De-Fang Huang

IPC: H01L23/544 ,  H01L21/268 ,  G03F9/00 ,  G03F7/20

CPC classification number: G03F9/7088 ,  G03F7/20 ,  G03F7/2004 ,  G03F9/7084 ,  H01L21/0274 ,  H01L21/2686 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a base layer having an active region and an edge region. A number of semiconductor devices is formed on the active region. The semiconductor wafer also includes a wafer identification. The wafer identification is formed on the edge region and used for identifying the semiconductor wafer. The semiconductor wafer further includes an alignment mark. The alignment mark is formed on the edge region and is used for performing an alignment process of the semiconductor wafer.

公开(公告)号：US11145521B2

公开(公告)日：2021-10-12

申请号：US15718044

申请日：2017-09-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Mei Hui Tsai ,  Hsiao-Yi Wang ,  Yen-Min Liao ,  Po-Sheng Lu

IPC: B08B3/04 ,  B08B3/10 ,  H01L21/67 ,  H01L23/60

Abstract: A method for cleaning a semiconductor substrate is provided. The method includes the steps of: applying a first agent onto a top surface of the semiconductor substrate while the semiconductor substrate is rotated at a first rotational frequency; immersing the semiconductor substrate in a second agent while rotating the semiconductor substrate at a second rotational frequency; and rotating the semiconductor substrate at a third rotational frequency while a third agent is introduced onto the top surface of the semiconductor substrate. The first rotational frequency may be greater than the third rotational frequency and the third rotational frequency is greater than the second rotational frequency. In some embodiments, the second rotational frequency is zero and the semiconductor substrate is held stationary during the immersing step.

公开(公告)号：US09952520B2

公开(公告)日：2018-04-24

申请号：US15460607

申请日：2017-03-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Shing-Kuei Lai ,  Wei-Yueh Tseng ,  Hsiao-Yi Wang ,  De-Fang Huang

IPC: H01L23/544 ,  G03F9/00 ,  H01L21/268 ,  H01L21/027 ,  G03F7/20

CPC classification number: G03F9/7088 ,  G03F7/20 ,  G03F7/2004 ,  G03F9/7084 ,  H01L21/0274 ,  H01L21/2686 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for aligning a semiconductor wafer is provided. The method includes providing the semiconductor wafer having two alignment marks formed on an active region or on an edge region of the semiconductor wafer. An included angle that is formed between the two alignment marks in a circumferential direction of the semiconductor wafer is between about 12 degrees and about 36 degrees. The method further includes receiving the detection signal reflected from at least one of the first alignment mark and the second alignment mark. The method also includes determining a parameter by a control system based on the received detection signal and moving the semiconductor wafer according to the parameter.