公开(公告)号：US11682647B2

公开(公告)日：2023-06-20

申请号：US16836934

申请日：2020-04-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Han Wang ,  Hung-Jui Kuo ,  Shih-Peng Tai ,  Yu-Hsiang Hu ,  I-Chia Chen

IPC: H01L23/00

CPC classification number: H01L24/20 ,  H01L24/19 ,  H01L2224/2101 ,  H01L2224/2105

Abstract: A semiconductor package including a plurality of semiconductor devices, an insulating layer, and a redistribution layer is provided. The insulating layer is disposed over the semiconductor device. The redistribution layer is disposed over the insulating layer and electrically connected to the semiconductor device. The redistribution layer includes a conductive line portion. The semiconductor package has a stitching zone, and the insulating layer has a ridge structure on a surface away from the semiconductor device and positioned within the stitching zone.

公开(公告)号：US20210313292A1

公开(公告)日：2021-10-07

申请号：US16836934

申请日：2020-04-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Han Wang ,  Hung-Jui Kuo ,  Shih-Peng Tai ,  Yu-Hsiang Hu ,  I-Chia Chen

IPC: H01L23/00

Abstract: A semiconductor package including a plurality of semiconductor devices, an insulating layer, and a redistribution layer is provided. The insulating layer is disposed over the semiconductor device. The redistribution layer is disposed over the insulating layer and electrically connected to the semiconductor device. The redistribution layer includes a conductive line portion. The semiconductor package has a stitching zone, and the insulating layer has a ridge structure on a surface away from the semiconductor device and positioned within the stitching zone.