公开(公告)号：US20240128148A1

公开(公告)日：2024-04-18

申请号：US18151222

申请日：2023-01-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Jung Hsueh ,  Po-Yao Lin ,  Hui-Min Huang ,  Ming-Da Cheng ,  Kathy Yan

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H10B80/00

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2924/1011 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1611 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1632

Abstract: A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.