公开(公告)号：US20240063079A1

公开(公告)日：2024-02-22

申请号：US17891218

申请日：2022-08-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Yu-Sheng Huang ,  Kuo Yang Wu ,  Chen-Hua Yu

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/44 ,  H01L23/373 ,  H01L25/065

CPC classification number: H01L23/3675 ,  H01L24/32 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/73 ,  H01L23/49838 ,  H01L21/4882 ,  H01L23/3677 ,  H01L23/44 ,  H01L23/3735 ,  H01L24/08 ,  H01L25/0655 ,  H01L24/29 ,  H01L2224/08235 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/3511 ,  H01L2924/182 ,  H01L2924/16196 ,  H01L2924/16235 ,  H01L2924/1632 ,  H01L2924/16587 ,  H01L2224/29187

Abstract: In an embodiment, a package is provided. The package includes a semiconductor device; an encapsulant laterally surrounding the semiconductor device; and a heat dissipation structure disposed over the semiconductor device and the encapsulant, wherein the heat dissipation structure includes a plurality of pillars and a porous layer extending over sidewalls of the plurality of pillars.