公开(公告)号：US20230375945A1

公开(公告)日：2023-11-23

申请号：US17749037

申请日：2022-05-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yi SHEN ,  Yao-Fong DAI ,  Yuan-Hsin CHI ,  Sheng-Yuan LIN

IPC: G03F7/20

CPC classification number: G03F7/70825 ,  H01L21/67742

Abstract: The present disclosure is directed to workpiece support for supporting a workpiece during semiconductor processing. The workpiece support includes one or more support frame bodies including a plurality of spaced apart spacers on a first surface of the support frame bodies. The spacers include a first surface spaced apart from the first surface of the support frame body. The spacing between the first surface of the spacers and the first surface of the support frame body results in the underside of the workpiece contacting the spacers but not contacting the first surface of the support frame body. Portions of the underside of the workpiece that do not contact the first surface of the support frame body are less susceptible to damage or accumulation of unwanted debris.

公开(公告)号：US20230383399A1

公开(公告)日：2023-11-30

申请号：US18446392

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yi SHEN ,  Hsin-Lin WU ,  Yao-Fong DAI ,  Pei-Yuan TAI ,  Chin-Wei CHEN ,  Yin-Tun CHOU ,  Yuan-Hsin CHI ,  Sheng-Yuan LIN

IPC: C23C14/56 ,  H01L21/687 ,  C23C16/455 ,  C23C14/50

CPC classification number: C23C14/564 ,  H01L21/68735 ,  H01L21/68771 ,  C23C16/455 ,  C23C14/50

Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.

公开(公告)号：US20220275500A1

公开(公告)日：2022-09-01

申请号：US17187410

申请日：2021-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yi SHEN ,  Hsin-Lin WU ,  Yao-Fong DAI ,  Pei-Yuan TAI ,  Chin-Wei CHEN ,  Yin-Tun CHOU ,  Yuan-Hsin CHI ,  Sheng-Yuan LIN

IPC: C23C14/56 ,  H01L21/687 ,  C23C14/50 ,  C23C16/455

Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.