公开(公告)号：US11545382B2

公开(公告)日：2023-01-03

申请号：US16853846

申请日：2020-04-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC: B08B3/04 ,  H01L21/677 ,  B08B3/08

Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.

公开(公告)号：US10665489B2

公开(公告)日：2020-05-26

申请号：US15249801

申请日：2016-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC: H01L21/67 ,  H01L21/677 ,  B08B3/04 ,  B08B3/08

Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

公开(公告)号：US20170372932A1

公开(公告)日：2017-12-28

申请号：US15249801

申请日：2016-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC: H01L21/677 ,  B08B3/08 ,  B08B3/04

Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

公开(公告)号：US20200251367A1

公开(公告)日：2020-08-06

申请号：US16853846

申请日：2020-04-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC: H01L21/677 ,  B08B3/08 ,  B08B3/04

Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.