Phase Change Memory Structure to Reduce Leakage from the Heating Element to the Surrounding Material
    2.
    发明申请
    Phase Change Memory Structure to Reduce Leakage from the Heating Element to the Surrounding Material 有权
    相变存储器结构,以减少从加热元件到周围材料的泄漏

    公开(公告)号:US20160064656A1

    公开(公告)日:2016-03-03

    申请号:US14471082

    申请日:2014-08-28

    Abstract: A phase change memory (PCM) cell with a heating element electrically isolated from laterally surrounding regions of the PCM cell by a cavity is provided. A dielectric region is arranged between first and second conductors. A heating plug is arranged within a hole extending through the dielectric region to the first conductor. The heating plug includes a heating element running along sidewalls of the hole, and includes a sidewall structure including a cavity arranged between the heating element and the sidewalls. A phase change element is in thermal communication with the heating plug and arranged between the heating plug and the second conductor. Also provide is a method for manufacturing the PCM cell.

    Abstract translation: 提供了具有通过空腔与PCM单元的横向周围区域电隔离的加热元件的相变存储器(PCM)单元。 电介质区域布置在第一和第二导体之间。 在穿过介电区延伸到第一导体的孔内布置加热塞。 加热插头包括沿着孔的侧壁延伸的加热元件,并且包括侧壁结构,该侧壁结构包括布置在加热元件和侧壁之间的空腔。 相变元件与加热塞热连通并且布置在加热塞和第二导体之间。 还提供了用于制造PCM单元的方法。

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