公开(公告)号：US11017522B2

公开(公告)日：2021-05-25

申请号：US16388435

申请日：2019-04-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chung-Pin Chou ,  In-Tsang Lin ,  Sheng-Wen Huang ,  Yu-Ting Wang ,  Jui-Kuo Lai ,  Hsin-Hui Chou ,  Jun-Xiu Liu ,  Tien-Wen Wang

IPC: G06T3/40 ,  G06K9/62 ,  H01L21/02 ,  H01L21/66 ,  G06T7/00

Abstract: A system includes an inspection device and an image processing unit. The inspection device is configured to scan a wafer to generate an inspected image. The image processing unit is configured to receive the inspected image, and is configured to analyze the inspected image by using at least one deep learning algorithm in order to determine whether there is any defect image shown in a region of interest in the inspected image. When there is at least one defect image shown in the region of interest in the inspected image, the inspection device is further configured to magnify the region of interest in the inspected image to generate a magnified inspected image for identification of defects.

公开(公告)号：US11935722B2

公开(公告)日：2024-03-19

申请号：US17870654

申请日：2022-07-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Sheng-Wen Huang ,  Jun-Xiu Liu

IPC: H01J37/28 ,  G06N20/00 ,  H01J37/153 ,  H01J37/22 ,  H01J37/26

CPC classification number: H01J37/28 ,  G06N20/00 ,  H01J37/153 ,  H01J37/22 ,  H01J37/261

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

公开(公告)号：US10825650B2

公开(公告)日：2020-11-03

申请号：US16430323

申请日：2019-06-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Sheng-Wen Huang ,  Jun-Xiu Liu

IPC: H01J37/28 ,  H01J37/22 ,  G06N20/00 ,  H01J37/26 ,  H01J37/153

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

公开(公告)号：US11424101B2

公开(公告)日：2022-08-23

申请号：US17069712

申请日：2020-10-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Sheng-Wen Huang ,  Jun-Xiu Liu

IPC: H01J37/28 ,  H01J37/22 ,  G06N20/00 ,  H01J37/26 ,  H01J37/153

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.