公开(公告)号：US20200091097A1

公开(公告)日：2020-03-19

申请号：US16133705

申请日：2018-09-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tuan-Yu Hung ,  Hung-Jui Kuo ,  Hsin-Yu Pan ,  Ming-che Ho ,  Tzu Yun Huang ,  Yen-Fu Su

IPC: H01L23/00

Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.

公开(公告)号：US11004812B2

公开(公告)日：2021-05-11

申请号：US16133705

申请日：2018-09-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tuan-Yu Hung ,  Hung-Jui Kuo ,  Hsin-Yu Pan ,  Ming-che Ho ,  Tzu Yun Huang ,  Yen-Fu Su

IPC: H01L23/00

Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.