公开(公告)号：US20200091097A1

公开(公告)日：2020-03-19

申请号：US16133705

申请日：2018-09-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tuan-Yu Hung ,  Hung-Jui Kuo ,  Hsin-Yu Pan ,  Ming-che Ho ,  Tzu Yun Huang ,  Yen-Fu Su

IPC: H01L23/00

Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.

公开(公告)号：US11004812B2

公开(公告)日：2021-05-11

申请号：US16133705

申请日：2018-09-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tuan-Yu Hung ,  Hung-Jui Kuo ,  Hsin-Yu Pan ,  Ming-che Ho ,  Tzu Yun Huang ,  Yen-Fu Su

IPC: H01L23/00

Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.

公开(公告)号：US20250118608A1

公开(公告)日：2025-04-10

申请号：US18482954

申请日：2023-10-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Yen-Fu Su ,  Tsung-Yu Chen

IPC: H01L23/18 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, an integrated circuit package component having a semiconductor die bonded to the substrate, and a ring structure on the substrate, wherein the ring structure may encircle the integrated circuit package component in a top-down view. The ring structure may comprise a first attached segment, a second attached segment attached to the substrate by an adhesive, and a first suspended segment between the first attached segment and the second attached segment. The first suspended segment may be suspended over the substrate. The first attached segment and the second attached segment may be spaced apart from the package component by a first distance and a second distance, respectively. The first suspended segment may be spaced apart from the package component by a third distance different from the first distance and the second distance.