公开(公告)号：US20200373267A1

公开(公告)日：2020-11-26

申请号：US16989461

申请日：2020-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Fu Shih ,  Chun-Yen Lo ,  Cheng-Lin Huang ,  Wen-Ming Chen ,  Chien-Ming Huang ,  Yuan-Fu Liu ,  Yung-Chiuan Cheng ,  Wei-Chih Huang ,  Chen-Hsun Liu ,  Chien-Pin Chan ,  Yu-Nu Hsu ,  Chi-Hung Lin ,  Te-Hsun Pang ,  Chin-Yu Ku

IPC: H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  C25D17/00 ,  C25D17/12 ,  C25D21/10

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

公开(公告)号：US20190252304A1

公开(公告)日：2019-08-15

申请号：US16396767

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pi-Lan Chang ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Hsu-Hsien Chen ,  Wei-Chih Huang ,  Chun-Ying Lin ,  Li-Chieh Chou

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is provided. The redistribution layer is disposed on the semiconductor die, and being electrically connected to the semiconductor die. The plurality of conductive balls is disposed between the redistribution layer and the circuit substrate. The semiconductor die is electrically connected to the circuit substrate through the conductive balls. Each of the conductive balls has a ball foot with a first width D1, a ball head with a third width D3 and a ball waist with a second width D2 located between the ball foot and the ball head. The ball foot is connected to the redistribution layer, the ball head is connected to the circuit substrate, and the ball waist is the narrowest portion of each of the conductive balls.

公开(公告)号：US11527504B2

公开(公告)日：2022-12-13

申请号：US16989461

申请日：2020-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Fu Shih ,  Chun-Yen Lo ,  Cheng-Lin Huang ,  Wen-Ming Chen ,  Chien-Ming Huang ,  Yuan-Fu Liu ,  Yung-Chiuan Cheng ,  Wei-Chih Huang ,  Chen-Hsun Liu ,  Chien-Pin Chan ,  Yu-Nu Hsu ,  Chi-Hung Lin ,  Te-Hsun Pang ,  Chin-Yu Ku

IPC: H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  C25D17/12 ,  C25D21/10 ,  C25D17/00 ,  H01L23/31 ,  C25D3/12 ,  C25D3/38 ,  C25D3/60

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

公开(公告)号：US10535593B2

公开(公告)日：2020-01-14

申请号：US16396767

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pi-Lan Chang ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Hsu-Hsien Chen ,  Wei-Chih Huang ,  Chun-Ying Lin ,  Li-Chieh Chou

IPC: H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L25/065 ,  H01L23/00

Abstract: A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is provided. The redistribution layer is disposed on the semiconductor die, and being electrically connected to the semiconductor die. The plurality of conductive balls is disposed between the redistribution layer and the circuit substrate. The semiconductor die is electrically connected to the circuit substrate through the conductive balls. Each of the conductive balls has a ball foot with a first width D1, a ball head with a third width D3 and a ball waist with a second width D2 located between the ball foot and the ball head. The ball foot is connected to the redistribution layer, the ball head is connected to the circuit substrate, and the ball waist is the narrowest portion of each of the conductive balls.

公开(公告)号：US10276481B2

公开(公告)日：2019-04-30

申请号：US15798416

申请日：2017-10-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pi-Lan Chang ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Hsu-Hsien Chen ,  Wei-Chih Huang ,  Chun-Ying Lin ,  Li-Chieh Chou

IPC: H01L23/48 ,  H01L21/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is provided. The redistribution layer is disposed on the semiconductor die, and being electrically connected to the semiconductor die. The plurality of conductive balls is disposed between the redistribution layer and the circuit substrate. The semiconductor die is electrically connected to the circuit substrate through the conductive balls. Each of the conductive balls has a ball foot with a first width D1, a ball head with a third width D3 and a ball waist with a second width D2 located between the ball foot and the ball head. The ball foot is connected to the redistribution layer, the ball head is connected to the circuit substrate, and the ball waist is the narrowest portion of each of the conductive balls.

公开(公告)号：US20180374785A1

公开(公告)日：2018-12-27

申请号：US15798416

申请日：2017-10-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pi-Lan Chang ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Hsu-Hsien Chen ,  Wei-Chih Huang ,  Chun-Ying Lin ,  Li-Chieh Chou

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is provided. The redistribution layer is disposed on the semiconductor die, and being electrically connected to the semiconductor die. The plurality of conductive balls is disposed between the redistribution layer and the circuit substrate. The semiconductor die is electrically connected to the circuit substrate through the conductive balls. Each of the conductive balls has a ball foot with a first width D1, a ball head with a third width D3 and a ball waist with a second width D2 located between the ball foot and the ball head. The ball foot is connected to the redistribution layer, the ball head is connected to the circuit substrate, and the ball waist is the narrowest portion of each of the conductive balls.