公开(公告)号：US11249112B2

公开(公告)日：2022-02-15

申请号：US16933576

申请日：2020-07-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Wei-Hsun Lin ,  Sen-Kuei Hsu ,  De-Jian Liu

IPC分类号： G01R1/073 ,  G01R1/067

摘要： A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.

公开(公告)号：US10718790B2

公开(公告)日：2020-07-21

申请号：US16378288

申请日：2019-04-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Wei-Hsun Lin ,  Sen-Kuei Hsu ,  De-Jian Liu

IPC分类号： G01R1/073 ,  G01R1/067

摘要： A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.

公开(公告)号：US09372227B2

公开(公告)日：2016-06-21

申请号：US13792323

申请日：2013-03-11

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Wei-Hsun Lin ,  Hao Chen ,  Chung-Han Huang

IPC分类号： G01R31/20 ,  G01R31/28

CPC分类号： G01R31/2889 ,  G01R31/2884

摘要： A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module.

摘要翻译： 用于测试被测器件（DUT）的系统包括探针卡和测试模块。 探针卡包括电耦合到电路板的探针台和耦合到电路板的第一多个电触点，其用于接合测试设备模块的多个电触点中的相应的一个。 探针耦合到相应的探针台并且被设置成接合DUT的电触点。 探针卡包括耦合到电路板的第二多个电触点。 第一和第二个联系人是相互排斥的。 测试模块包括存储器，处理器和电耦合到探针卡的第二多个电触点中的相应电触头的多个电触头。 电路板包括用于将测试设备模块电耦合到测试模块的第一电路径。

公开(公告)号：US10274518B2

公开(公告)日：2019-04-30

申请号：US15140758

申请日：2016-04-28

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Wei-Hsun Lin ,  Sen-Kuei Hsu ,  De-Jian Liu

IPC分类号： G01R1/073 ,  G01R1/067

摘要： A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.

公开(公告)号：US09354254B2

公开(公告)日：2016-05-31

申请号：US13865243

申请日：2013-04-18

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Wei-Hsun Lin ,  Sen-Kuei Hsu ,  De-Jian Liu

IPC分类号： G01R31/20 ,  G01R1/073 ,  G01R1/067

CPC分类号： G01R1/07314 ,  G01R1/06794 ,  G01R1/07364

摘要： A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.

摘要翻译： 公开了一种具有减小探针卡翘曲的测试装置和减少测试装置的探针卡翘曲的方法。 测试装置可以包括测试头和与测试头相对的平台，其中测试头和平台相对于彼此移动以使样本与测试装置的探测尖端接触。 测试头可以包括探针卡印刷电路板，加强件，不连续的支撑件和多个探测尖端。 加强件可以联接到并加强探针卡。 不连续的支撑件可以从探针卡延伸到加强件，并且可以包括从加强件延伸到探针卡的至少一个未填充的空隙。 多个探测尖端可以从测试头的远端延伸。