公开(公告)号：US20020194790A1

公开(公告)日：2002-12-26

申请号：US09886864

申请日：2001-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.,

Inventor： Ting-Chun Wang ,  Hsi-Kuei Cheng ,  Yu-Ku Lin ,  Yi-Lang Wang

IPC: C09K003/14 ,  C09C001/68

CPC classification number: B24B53/017 ,  B24D3/06 ,  B24D18/0054

Abstract: A method for fabricating diamond conditioning disc and the disc fabricated are described. In the method, a substrate for a diamond conditioning disc is first provided, a layer of a binder material such as an alloy of nickel is then coated on top of the diamond conditioning disc, a plurality of diamond particles is then implanted in a layer of binder material such that not more than null of a diameter, or of a height of the multiplicity of diamond particles is exposed above a top surface of the layer of the binder material. In a preferred embodiment, the multiplicity of diamond particles is implanted in a layer of binder material such that between about null and about null of a diameter, or of a height of the particles is exposed, or protruded above a top surface of the binder material layer.

Abstract translation: 描述了制造金刚石调节盘和制造的盘的方法。 在该方法中，首先提供用于金刚石调节盘的基板，然后将诸如镍合金的粘合剂材料层涂覆在金刚石调节盘的顶部上，然后将多个金刚石颗粒注入到 粘合剂材料，使得不超过直径的2/3或多个金刚石颗粒的高度暴露在粘合剂材料层的顶表面上方。 在一个优选的实施方案中，将多个金刚石颗粒注入到粘合剂材料层中，使得直径的大约1/2至大约2/3，或者颗粒的高度暴露于或高于 粘合剂材料层。

公开(公告)号：US20030230237A1

公开(公告)日：2003-12-18

申请号：US10170957

申请日：2002-06-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsi-Kuei Cheng ,  Ting-Chu Wang ,  Yu-Ku Lin ,  Chin-Te Huang ,  Huai-Tei Yang ,  Chun-Chang Chen ,  Yi-Lang Wang

IPC: B05C013/00 ,  B05C013/02

CPC classification number: H01L21/68735 ,  H01L21/6875 ,  Y10S269/903

Abstract: An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.

Abstract translation: 用于半导体晶片的改进的环形支撑通过使用仅与晶片线接触的支撑销来减少边缘斜切操作期间晶片的污染。 支撑销围绕环的周边间隔开并且具有三角形横截面。 销的两个相交的侧面形成限定与晶片的线接触的边缘。 这些相交侧优选以60度和80度之间的角度相对于晶片倾斜。

公开(公告)号：US20030127107A1

公开(公告)日：2003-07-10

申请号：US10043017

申请日：2002-01-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Aaron Cheng ,  Ting-Chun Wang ,  Yu-Ku Lin ,  Chun-Chang Chen ,  Yi-Lang Wang

IPC: B08B003/02

CPC classification number: H01L21/67051 ,  B08B3/02 ,  H01L21/32134 ,  Y10S134/902

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.

Abstract translation: 描述了从晶片上的对准标记的顶部去除涂层的设备和方法。 该装置包括一个作为空腔的清洁室和悬挂在空腔中的盖构件，可旋转地安装在盖构件中的晶片卡盘，用于将晶片保持在倒置位置，使得对准标记面向下，并且在 至少两个溶剂分配臂安装在盖构件的外周区域中，其紧邻卡盘，用于当晶片保持在静止位置时向上朝向晶片的有效表面分配溶剂流， 至少两个溶剂分配臂对应于一个对准标记的位置定位。