公开(公告)号：US12278162B2

公开(公告)日：2025-04-15

申请号：US18366481

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L23/367 ,  H01L25/00 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US11973005B2

公开(公告)日：2024-04-30

申请号：US17392904

申请日：2021-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L25/00 ,  H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/433 ,  H01L23/3675 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L23/49833 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US20220359345A1

公开(公告)日：2022-11-10

申请号：US17392904

申请日：2021-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US20240014100A1

公开(公告)日：2024-01-11

申请号：US18366481

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L23/367

CPC classification number: H01L23/433 ,  H01L25/0655 ,  H01L25/0652 ,  H01L25/50 ,  H01L23/3675 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.