公开(公告)号：US20180082834A1

公开(公告)日：2018-03-22

申请号：US15272876

申请日：2016-09-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Ho CHEN

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02019 ,  H01L21/67086 ,  H01L21/67757

Abstract: A method for performing a wet chemical process over a semiconductor wafer is provided. The method includes moving the semiconductor wafer into a chemical solution. The method further includes leaving the semiconductor wafer in the chemical solution for a processing time period. The method also includes turning the semiconductor wafer upside down while the wafer is in the chemical solution. Moreover, the method includes removing the semiconductor wafer from the chemical solution.

公开(公告)号：US20130286365A1

公开(公告)日：2013-10-31

申请号：US13928414

申请日：2013-06-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Ho CHEN ,  Wen-Chieh TSOU ,  Chih-Wei HUANG ,  Wei-Cheng WANG

IPC: G03F7/20

CPC classification number: G03F7/70741 ,  G05B19/4189 ,  G05B2219/45031 ,  G05B2219/45057 ,  Y02P90/28

Abstract: At least a first reticle is stored in a housing of a stocker. A first gas is delivered to the housing. At least one reticle pod having an additional reticle is delivered into a enclosure within the housing of the stocker. A second gas different from the first gas is delivered to the enclosure. The reticle pod is automatically retrieved from the enclosure. The delivery and retrieval of the reticle pod and delivery of the first gas and the second gas are automatically controlled.