公开(公告)号：US20220184773A1

公开(公告)日：2022-06-16

申请号：US17685760

申请日：2022-03-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC分类号： B24B37/32 ,  H01L21/321 ,  B24B37/20 ,  B24B37/015

摘要： In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.