公开(公告)号：US20220336181A1

公开(公告)日：2022-10-20

申请号：US17376208

申请日：2021-07-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Po-Tang Tseng ,  Ching-Heng Yen ,  Tai-Kun Kao ,  Sheng-Tai Peng

IPC分类号： H01J27/08 ,  H01J27/02 ,  H01L21/26 ,  H01J37/317

摘要： An assembly present in an ion source for supporting an arc chamber upon a base plate includes a first arc support plate, a first screw, and a second screw. The first screw passes through a smooth through-hole in an arm of the first arc support plate and extends into a bore in the base plate. The second (or adjustable) screw passes through a threaded through-hole in an arm of the first arc support plate and engages an upper surface of the base plate itself, and can be used to change the altitude and angle of the first arc support plate relative to the base plate. This adjustment ability improves the beam quality of the ion source.

公开(公告)号：US20240282543A1

公开(公告)日：2024-08-22

申请号：US18651012

申请日：2024-04-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Po-Tang Tseng ,  Ching-Heng Yen ,  Tai-Kun Kao ,  Sheng-Tai Peng

IPC分类号： H01J27/08 ,  H01J27/02 ,  H01J37/317 ,  H01L21/26

CPC分类号： H01J27/08 ,  H01J27/022 ,  H01J37/3171 ,  H01L21/26 ,  H01J2237/31701

摘要： An assembly present in an ion source for supporting an arc chamber upon a base plate includes a first arc support plate, a first screw, and a second screw. The first screw passes through a smooth through-hole in an arm of the first arc support plate and extends into a bore in the base plate. The second (or adjustable) screw passes through a threaded through-hole in an arm of the first arc support plate and engages an upper surface of the base plate itself, and can be used to change the altitude and angle of the first arc support plate relative to the base plate. This adjustment ability improves the beam quality of the ion source.

公开(公告)号：US20220184773A1

公开(公告)日：2022-06-16

申请号：US17685760

申请日：2022-03-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC分类号： B24B37/32 ,  H01L21/321 ,  B24B37/20 ,  B24B37/015

摘要： In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.

公开(公告)号：US12002647B2

公开(公告)日：2024-06-04

申请号：US17376208

申请日：2021-07-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Po-Tang Tseng ,  Ching-Heng Yen ,  Tai-Kun Kao ,  Sheng-Tai Peng

IPC分类号： H01J27/08 ,  H01J27/02 ,  H01J37/317 ,  H01L21/26

CPC分类号： H01J27/08 ,  H01J27/022 ,  H01J37/3171 ,  H01L21/26 ,  H01J2237/31701

摘要： An assembly present in an ion source for supporting an arc chamber upon a base plate includes a first arc support plate, a first screw, and a second screw. The first screw passes through a smooth through-hole in an arm of the first arc support plate and extends into a bore in the base plate. The second (or adjustable) screw passes through a threaded through-hole in an arm of the first arc support plate and engages an upper surface of the base plate itself, and can be used to change the altitude and angle of the first arc support plate relative to the base plate. This adjustment ability improves the beam quality of the ion source.

公开(公告)号：US11850702B2

公开(公告)日：2023-12-26

申请号：US17685760

申请日：2022-03-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC分类号： B24B37/32 ,  B24B37/015 ,  B24B37/20 ,  H01L21/321

CPC分类号： B24B37/32 ,  B24B37/015 ,  B24B37/20 ,  H01L21/3212

摘要： In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.