公开(公告)号：US20240083742A1

公开(公告)日：2024-03-14

申请号：US18510628

申请日：2023-11-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ting-Li YANG ,  Kai-Di WU ,  Ming-Da CHENG ,  Wen-Hsiung LU ,  Cheng Jen LIN ,  Chin Wei KANG

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0081 ,  B81C1/0069 ,  B81B2203/0127 ,  B81B2203/019 ,  B81B2203/0353 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2201/0181 ,  B81C2203/032 ,  B81C2203/0735

摘要： A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.