公开(公告)号：US20240021416A1

公开(公告)日：2024-01-18

申请号：US17866640

申请日：2022-07-18

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Ming-Sze Chen ,  Hung-Chih Wang ,  Yuan-Hsin Chi ,  Sheng-Yuan Lin

IPC: H01J37/32 ,  F16L13/14

CPC classification number: H01J37/32522 ,  H01J37/32513 ,  F16L13/14 ,  H01J37/3288 ,  H01J37/32807

Abstract: A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.

公开(公告)号：US20220344191A1

公开(公告)日：2022-10-27

申请号：US17382506

申请日：2021-07-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

Inventor： Chih-Wei CHOU ,  Sheng-Yuan Lin ,  Yuan-Hsin Chi ,  Yin-Tun Chou ,  Hung-Chih Wang ,  Yu-Chi Liu

IPC: H01L21/677 ,  B65G47/90

Abstract: A wafer pod transfer assembly is provided. The wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

公开(公告)号：US12040163B2

公开(公告)日：2024-07-16

申请号：US17866640

申请日：2022-07-18

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Ming-Sze Chen ,  Hung-Chih Wang ,  Yuan-Hsin Chi ,  Sheng-Yuan Lin

IPC: F16L13/14 ,  F16L33/207 ,  F16L33/22 ,  H01J37/32

CPC classification number: H01J37/32522 ,  F16L13/14 ,  H01J37/32513 ,  F16L33/2073 ,  F16L33/223 ,  H01J37/32807 ,  H01J37/3288

Abstract: A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.

公开(公告)号：US12002699B2

公开(公告)日：2024-06-04

申请号：US18117593

申请日：2023-03-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

Inventor： Chih-Wei Chou ,  Sheng-Yuan Lin ,  Yuan-Hsin Chi ,  Yin-Tun Chou ,  Hung-Chih Wang ,  Yu-Chi Liu

IPC: H01L21/677 ,  B65G47/90

CPC classification number: H01L21/67766 ,  B65G47/90

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

公开(公告)号：US11600506B2

公开(公告)日：2023-03-07

申请号：US17382506

申请日：2021-07-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

Inventor： Chih-Wei Chou ,  Sheng-Yuan Lin ,  Yuan-Hsin Chi ,  Yin-Tun Chou ,  Hung-Chih Wang ,  Yu-Chi Liu

IPC: H01L21/677 ,  B65G47/90

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.