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公开(公告)号:US12051569B2
公开(公告)日:2024-07-30
申请号:US18133408
申请日:2023-04-11
Applicant: Samsung Display Co., LTD.
Inventor: Kwan Yong Lee , Yong Kuk Kim , Ji Hoon Shin , Chang Jo Lee , Sung Ryul Cho , Sang Jin Ha
CPC classification number: H01J37/32559 , C23C14/3407 , C23C14/3471 , C23C14/351 , H01J37/32651 , H01J37/3266 , H01J37/32807
Abstract: A deposition apparatus includes a shield member having a lattice shape in a plan view, the lattice shape including short side edges extending along a first direction and long side edges extending along a second direction, the short side edges including first and second short side edges, a bracket member including a first bracket member coupled to the first short side edge, and a second bracket member coupled to the second short side edge, a plurality of anode bars extending along the second direction and stably placed on each of the first bracket member and the second bracket member, and a target member covering the plurality of anode bars. An anode bar of the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, and the anode bar is physically separated from the shield member by the bracket member.
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公开(公告)号:US20240183656A1
公开(公告)日:2024-06-06
申请号:US18401881
申请日:2024-01-02
Applicant: Applied Materials, Inc.
Inventor: Yogananda Sarode Vishwanath , Phillip A. Criminale
IPC: G01B11/30 , H01J37/32 , H01L21/683 , H01L21/687
CPC classification number: G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
Abstract: A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, where the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.
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公开(公告)号:US20240120180A1
公开(公告)日:2024-04-11
申请号:US18546174
申请日:2022-02-25
Applicant: Lam Research Corporation
Inventor: Yuanping SONG , Johnny PHAM , Yiwei SONG , Lin XU , Christopher KIMBALL
CPC classification number: H01J37/32477 , B05D1/02 , H01J37/32715 , H01J37/32807 , B05D2203/30 , B05D2506/10 , H01J2237/0213
Abstract: A component in a semiconductor processing chamber is provided. An electrically conductive semiconductor or metal body has a CTE of less than 10.0×10−6/K. An intermediate layer is disposed over at least one surface of the body, the intermediate layer comprising a fluoropolymer. A perfluoroalkoxy alkane (PFA) layer is disposed over the intermediate layer to form the component.
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公开(公告)号:US20240096606A1
公开(公告)日:2024-03-21
申请号:US18208046
申请日:2023-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: HYUNGSIK KO
IPC: H01J37/32
CPC classification number: H01J37/32807 , H01J37/32495 , H01J37/32513
Abstract: Provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.
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公开(公告)号:US11913777B2
公开(公告)日:2024-02-27
申请号:US16946147
申请日:2020-06-08
Applicant: Applied Materials, Inc.
Inventor: Yogananda Sarode Vishwanath , Phillip A. Criminale
IPC: G01B11/30 , H01J37/32 , H01L21/687 , H01L21/683
CPC classification number: G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
Abstract: A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A a printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, wherein the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.
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公开(公告)号:US20240038503A1
公开(公告)日:2024-02-01
申请号:US18354022
申请日:2023-07-18
Applicant: HANA MATERIALS INC.
Inventor: Je Guen YU , Aran AN , Wang Ki CHOI , Eun Young LEE
IPC: H01J37/32
CPC classification number: H01J37/32642 , H01J37/32807 , H01J2237/3341
Abstract: A focus ring and a method for manufacturing the same. The focus ring include a first ring made of a first material, a second ring covered by the first ring, wherein the second ring is made of a second material different from the first material, and a fastening member configured to couple the first ring to the second ring. The fastening member includes a through-part configured to pass through the second ring and a buried part buried in a lower portion of the first ring. The through-part has a first diameter, and the buried part has a second diameter greater than or equal to the first diameter.
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公开(公告)号:US20240021416A1
公开(公告)日:2024-01-18
申请号:US17866640
申请日:2022-07-18
Inventor: Ming-Sze Chen , Hung-Chih Wang , Yuan-Hsin Chi , Sheng-Yuan Lin
CPC classification number: H01J37/32522 , H01J37/32513 , F16L13/14 , H01J37/3288 , H01J37/32807
Abstract: A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.
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公开(公告)号:US20230411127A1
公开(公告)日:2023-12-21
申请号:US17842565
申请日:2022-06-16
Inventor: Tai-Jung CHUANG , Chiao-Yuan HSIAO , Yung-Chan CHEN , Wei Kang CHUNG , Yu-Li LIN , Jui Fu HSIEH , Chih-Teng LIAO
IPC: H01J37/32 , H01L21/66 , H01L21/311
CPC classification number: H01J37/32807 , H01J37/32449 , H01L22/26 , H01L21/31116 , H01J2237/334 , H01J2237/24585
Abstract: Embodiments are directed to a method of operating a plasma processing system by retrofitting one or more components thereof. The method includes removing a holder from a gas supply mechanism of the plasma processing system. The holder includes a gas injector that is configured to provide gas received from a gas source to a plasma chamber of the plasma processing system. The method further includes reducing a size of a guide pin of the holder, installing the holder including the guide pin having the reduced size in the gas supply mechanism, and rotating the gas injector to change a flow of gas through the gas injector.
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公开(公告)号:US20230317436A1
公开(公告)日:2023-10-05
申请号:US18192304
申请日:2023-03-29
Applicant: Semes Co., Ltd.
Inventor: Dukhyun Son , Jihun Kim , Yeonghun Wi
IPC: H01J37/32 , H01L21/687 , H01L21/683
CPC classification number: H01J37/32807 , H01L21/68742 , H01J37/32715 , H01L21/68721 , H01J37/32642 , H01L21/6831 , H01J2237/3343 , H01J2237/024 , H01J2237/2007
Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.
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公开(公告)号:US20230253190A1
公开(公告)日:2023-08-10
申请号:US18133408
申请日:2023-04-11
Applicant: Samsung Display Co., LTD.
Inventor: Kwan Yong LEE , Yong Kuk KIM , Ji Hoon SHIN , Chang Jo LEE , Sung Ryul CHO , Sang Jin HA
CPC classification number: H01J37/32559 , C23C14/3407 , C23C14/351 , H01J37/32651 , H01J37/3266 , H01J37/32807 , C23C14/3471
Abstract: A deposition apparatus includes a shield member having a lattice shape in a plan view, the lattice shape including short side edges extending along a first direction and long side edges extending along a second direction, the short side edges including first and second short side edges, a bracket member including a first bracket member coupled to the first short side edge, and a second bracket member coupled to the second short side edge, a plurality of anode bars extending along the second direction and stably placed on each of the first bracket member and the second bracket member, and a target member covering the plurality of anode bars. An anode bar of the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, and the anode bar is physically separated from the shield member by the bracket member.
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