PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240096606A1

    公开(公告)日:2024-03-21

    申请号:US18208046

    申请日:2023-06-09

    Inventor: HYUNGSIK KO

    CPC classification number: H01J37/32807 H01J37/32495 H01J37/32513

    Abstract: Provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.

    FOCUS RING AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240038503A1

    公开(公告)日:2024-02-01

    申请号:US18354022

    申请日:2023-07-18

    CPC classification number: H01J37/32642 H01J37/32807 H01J2237/3341

    Abstract: A focus ring and a method for manufacturing the same. The focus ring include a first ring made of a first material, a second ring covered by the first ring, wherein the second ring is made of a second material different from the first material, and a fastening member configured to couple the first ring to the second ring. The fastening member includes a through-part configured to pass through the second ring and a buried part buried in a lower portion of the first ring. The through-part has a first diameter, and the buried part has a second diameter greater than or equal to the first diameter.

    SUBSTRATE PROCESSING APPARATUS
    9.
    发明公开

    公开(公告)号:US20230317436A1

    公开(公告)日:2023-10-05

    申请号:US18192304

    申请日:2023-03-29

    Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.

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