公开(公告)号：US20240096818A1

公开(公告)日：2024-03-21

申请号：US18303659

申请日：2023-04-20

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Harry-Hak-Lay Chuang ,  Yuan-Jen Lee ,  Kuo-An Liu ,  Ching-Huang Wang ,  C.T. Kuo ,  Tien-Wei Chiang

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L23/552 ,  H01L25/0655 ,  H01L25/50 ,  H10B80/00 ,  H10B61/00

Abstract: Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.