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公开(公告)号：US20070020053A1
公开(公告)日：2007-01-25
申请号：US11489491
申请日：2006-07-20
IPC分类号： B23B35/00
CPC分类号： B23B35/00 , B23B39/161 , B23B39/24 , B23B2228/36 , B23B2270/486 , B23B2270/54 , H05K3/0008 , H05K3/0047 , H05K3/0097 , Y10T408/03 , Y10T408/175
摘要： There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.
摘要翻译： 提供了一种能够通过降低加工精度的分散来提高印刷板钻孔设备的加工精度的钻孔方法，即使它是多轴印刷板钻孔设备。 在旋转钻头的每个主轴的每转的转数中预先检测钻头的轴心在X和Y方向上相对于设计的轴心的偏移。 通过为每个主轴制造至少一个直径的孔，例如曝光主孔，并且通过所有其他直径的孔几乎同时由所有主轴制成两个或更多种直径的孔。
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公开(公告)号：US07637702B2
公开(公告)日：2009-12-29
申请号：US11489491
申请日：2006-07-20
IPC分类号： B23B35/00
CPC分类号： B23B35/00 , B23B39/161 , B23B39/24 , B23B2228/36 , B23B2270/486 , B23B2270/54 , H05K3/0008 , H05K3/0047 , H05K3/0097 , Y10T408/03 , Y10T408/175
摘要： There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.
摘要翻译： 提供了一种能够通过降低加工精度的分散来提高印刷板钻孔设备的加工精度的钻孔方法，即使它是多轴印刷板钻孔设备。 在旋转钻头的每个主轴的一定转数中，预先检测钻头的轴心在X和Y方向上相对于设计的轴向中心的偏移。 通过为每个主轴制造至少一个直径的孔，例如曝光主孔，并且通过所有其他直径的孔几乎同时由所有主轴制成两个或更多种直径的孔。
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公开(公告)号：US07130715B2
公开(公告)日：2006-10-31
申请号：US10679408
申请日：2003-10-07
IPC分类号： G06F19/00
CPC分类号： G05B19/402 , B23Q17/2233 , G05B2219/41192 , G05B2219/45035 , H05K3/0008 , H05K3/0047 , H05K2203/163 , Y10T29/49778
摘要： In a machining method and a machining apparatus, prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.
摘要翻译： 在加工方法和加工装置中，在加工之前，NC控制单元使X轴驱动单元基于预先规定的检查条件移动台。 因此，NC控制单元获得从中毒命令的命令到达时间所需的稳定时间，并且获得在预定允许范围内使表的位置响应稳定。 类似地，为了在Y轴方向上移动钻头，NC控制单元在预定的允许范围内获得稳定位置响应所需的稳定时间。 在加工时，一旦获得的稳定时间过去，钻头就沿Z轴方向移动，从而切割成印刷线路板。
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公开(公告)号：US5200906A
公开(公告)日：1993-04-06
申请号：US616846
申请日：1990-11-21
IPC分类号： G05B19/4099
CPC分类号： G05B19/4099
摘要： Ratios between a distance between an upper wire guide and the upper surface of a workpiece to be machined, a thickness of the workpiece and a distance between a lower wire guide and the lower surface of the workpiece are given to the inlet and outlet positions of a wire electrode at the upper and lower surfaces of the workpiece which have been interpolated so as to directly obtain displacement positions of the upper and lower wire guides, along which the upper and lower wire guides are moved successively, thereby obtaining an articles which is accurately machined with a relatively simple machining procedure.
摘要翻译： 在上部导线器和待加工的工件的上表面之间的距离，工件的厚度和下部电线引导件与工件的下表面之间的距离之间的比率被赋予一个 在被插入的工件的上表面和下表面上的线电极，以便直接获得上，下导线器的位移位置，沿着上下导线引导件依次移动，从而获得准确加工的制品 具有相对简单的加工程序。
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