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公开(公告)号：US07507058B2
公开(公告)日：2009-03-24
申请号：US11252616
申请日：2005-10-19
IPC分类号： B23B51/02
CPC分类号： B23C5/28 , B23B49/005 , B23B51/06 , B23C2210/52 , B23C2250/12 , B23C2255/12 , H05K3/0047 , Y10T279/3487 , Y10T408/8925 , Y10T408/907 , Y10T408/99 , Y10T409/308624
摘要： A tool positioning device and a machining element have simple structures which can reduce running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole, for example, instead of the channel.
摘要翻译： 刀具定位装置和加工元件结构简单，可以降低运行成本。 除了与端铣刀的柄接合的孔之外，还设置有通道，使得其通过装置，使得其一端与装置的上表面连通，另一端与 设备。 在这种情况下，提供对上表面开口并与孔连通的凹部更为有效。 例如通过制造圆柱形孔而不是通道可以获得相同的效果。
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公开(公告)号：US07249485B2
公开(公告)日：2007-07-31
申请号：US10935218
申请日：2004-09-08
申请人： Yuji Honda , Katsuhiro Nagasawa
发明人： Yuji Honda , Katsuhiro Nagasawa
IPC分类号： B21J13/10
CPC分类号： B65H23/032
摘要： Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.
摘要翻译： 用于处理准确定位在长胶片中的孔的基板处理装置，包括：用于支撑工件的工件支撑装置; 用于将工件夹紧到工件支撑装置上的夹紧装置; 用于在工件的传送方向上移动工件支撑装置的第一移动装置; 用于引导工作支撑装置的引导装置; 用于支撑这些引导装置的引导支撑装置; 以及第二移动装置，用于沿着与工件的传送方向垂直的方向移动引导支撑装置，其中两个销或孔设置在每个引导装置上或每个引导装置中，设置有与销或孔接合的孔或销 在每个导向支撑装置上或其中的每一个中，以引导装置和导向支撑装置为格栅形式组合，并且安装四个接合点处的孔和销。
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3.发明申请公开(公告)号：US20060127652A1
公开(公告)日：2006-06-15
申请号：US11297358
申请日：2005-12-09
申请人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
发明人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
CPC分类号： H05K3/429 , H05K1/0268 , H05K3/0047 , H05K2201/092 , H05K2201/09718 , H05K2201/09845 , H05K2203/0207 , H05K2203/0242 , H05K2203/163 , H05K2203/175 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926
摘要： There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.
摘要翻译： 提供了一种多层电路板和多层电路板的制造方法，其允许电子部件被适当地安装，并且不会妨碍电子部件的性能。 要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。 在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。 在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。 基于工具与检测孔电导通，设定孔的深度。 通孔的不必要的板可以被大孔除去。
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公开(公告)号：US20050115796A1
公开(公告)日：2005-06-02
申请号：US10935218
申请日：2004-09-08
申请人： Yuji Honda , Katsuhiro Nagasawa
发明人： Yuji Honda , Katsuhiro Nagasawa
IPC分类号： B26D7/01 , B21D33/00 , B23B47/00 , B23B47/28 , B23K26/10 , B23K37/00 , B23K37/04 , B23Q3/06 , B23Q5/22 , B23Q7/00 , B26F1/16 , B65G49/00 , B65H20/18 , B65H23/032 , B65H23/035 , H01L21/68 , H05K3/00
CPC分类号： B65H23/032
摘要： Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.
摘要翻译： 用于处理准确定位在长胶片中的孔的基板处理装置，包括：用于支撑工件的工件支撑装置; 用于将工件夹紧到工件支撑装置上的夹紧装置; 用于在工件的传送方向上移动工件支撑装置的第一移动装置; 用于引导工作支撑装置的引导装置; 用于支撑这些引导装置的引导支撑装置; 以及第二移动装置，用于沿着与工件的传送方向垂直的方向移动引导支撑装置，其中两个销或孔设置在每个引导装置上或每个引导装置中，设置有与销或孔接合的孔或销 在每个导向支撑装置上或其中的每一个中，以引导装置和导向支撑装置为格栅形式组合，并且安装四个接合点处的孔和销。
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公开(公告)号：US06623219B2
公开(公告)日：2003-09-23
申请号：US09758877
申请日：2001-01-11
申请人： Katsuhiro Nagasawa , Tamio Otani , Akira Irie
发明人： Katsuhiro Nagasawa , Tamio Otani , Akira Irie
IPC分类号： B23Q502
CPC分类号： B23Q5/40 , B23Q1/601 , B23Q39/04 , H05K3/0008 , H05K3/0047 , Y10T408/3806 , Y10T408/3811 , Y10T409/308288
摘要： Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.
摘要翻译： 螺母22,23与一个滚珠丝杠10接合，螺母22直接固定在滑块主体7s上。 螺母23由轴承25可旋转地保持，并且将保持轴承25的轴承保持件24固定在滑块主体7t上。 并且，齿轮26固定在螺母23的侧面，并且设置有与齿轮26啮合的齿轮29。 并且，用于驱动齿轮29的马达28固定在托架27上，与拉头主体7t结合。 滚珠丝杠10停止，马达28旋转，以分开定位滑块7b。 即使滑块的数量增加，也不会使机器变大，可以提供结构简单的印刷电路板加工机。
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公开(公告)号：US07476065B2
公开(公告)日：2009-01-13
申请号：US11139588
申请日：2005-05-31
IPC分类号： B23B35/00
CPC分类号： H05K3/0047 , B23Q17/2233 , H05K2203/0207 , Y10T408/03 , Y10T408/175 , Y10T408/36 , Y10T408/50 , Y10T408/5623
摘要： A printed board drilling method and a printed board machining apparatus capable of improving machining quality, such as improving positional accuracy of holes and true roundness of machined holes, and improving work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out of a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle holds the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.
摘要翻译： 一种能够改善加工质量的印刷板钻孔方法和印刷板加工装置，例如提高孔的位置精度和加工孔的真实圆度，并且通过最小化钻头尖端的跳动来提高加工效率。 当钻头由主轴保持时，从主轴延伸出来的钻头的延伸部分是根据每个钻头的类型或使用方式进行预先确定的。 在对应于在印刷板中要钻孔的孔的形状的多个钻孔中选择一个钻头，并且主轴保持钻头，使得所选择的钻头通过对应于所选钻头的延伸而从主轴延伸出轴。 然后，控制主轴相对于印刷电路板的移动，所选择的钻头由主轴旋转驱动以钻出印刷电路板。
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公开(公告)号：US07959385B2
公开(公告)日：2011-06-14
申请号：US12153591
申请日：2008-05-21
IPC分类号： B23B41/00
CPC分类号： H05K3/0047 , H05K2203/0278 , Y10T408/50 , Y10T408/56245 , Y10T408/56253
摘要： A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.
摘要翻译： 一种印刷电路板加工装置，包括：保持用于加工印刷电路板的工具的主轴和用于在印刷电路板加工中将印刷电路板压到工作台上的压力单元。 压力单元包括可沿主轴向下移动的压脚，具有多个压力件的旋转构件，通过该通孔形成用于通过工具的通孔，并设置成用于选择多个压力块中的一个， 用于移动旋转构件的电动机，用于上下移动压脚的气缸和电磁阀以及用于控制气缸和电磁阀的控制部。 控制部旋转电动机，以选择压力件并控制气缸和电磁阀来改变按压印刷电路板的力。
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公开(公告)号：US07488676B2
公开(公告)日：2009-02-10
申请号：US11297358
申请日：2005-12-09
申请人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
发明人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
IPC分类号： H01L21/4763
CPC分类号： H05K3/429 , H05K1/0268 , H05K3/0047 , H05K2201/092 , H05K2201/09718 , H05K2201/09845 , H05K2203/0207 , H05K2203/0242 , H05K2203/163 , H05K2203/175 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926
摘要： A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.
摘要翻译： 多层电路板的制造方法允许电子部件被充分地安装，并且不会妨碍电子部件的性能。 要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。 在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。 在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。 基于与检测孔导电的工具设定孔的深度。 通孔的不必要的板可以被大孔除去。
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公开(公告)号：US20080292416A1
公开(公告)日：2008-11-27
申请号：US12153591
申请日：2008-05-21
IPC分类号： B23B47/00
CPC分类号： H05K3/0047 , H05K2203/0278 , Y10T408/50 , Y10T408/56245 , Y10T408/56253
摘要： A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.
摘要翻译： 一种印刷电路板加工装置，包括：保持用于加工印刷电路板的工具的主轴和用于在印刷电路板加工中将印刷电路板压到工作台上的压力单元。 压力单元包括可沿主轴向下移动的压脚，具有多个压力件的旋转构件，通过该通孔形成用于通过工具的通孔，并设置成用于选择多个压力块中的一个， 用于移动旋转构件的电动机，用于上下移动压脚的气缸和电磁阀以及用于控制气缸和电磁阀的控制部。 控制部旋转电动机，以选择压力件并控制气缸和电磁阀来改变按压印刷电路板的力。
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公开(公告)号：US20070020053A1
公开(公告)日：2007-01-25
申请号：US11489491
申请日：2006-07-20
IPC分类号： B23B35/00
CPC分类号： B23B35/00 , B23B39/161 , B23B39/24 , B23B2228/36 , B23B2270/486 , B23B2270/54 , H05K3/0008 , H05K3/0047 , H05K3/0097 , Y10T408/03 , Y10T408/175
摘要： There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.
摘要翻译： 提供了一种能够通过降低加工精度的分散来提高印刷板钻孔设备的加工精度的钻孔方法，即使它是多轴印刷板钻孔设备。 在旋转钻头的每个主轴的每转的转数中预先检测钻头的轴心在X和Y方向上相对于设计的轴心的偏移。 通过为每个主轴制造至少一个直径的孔，例如曝光主孔，并且通过所有其他直径的孔几乎同时由所有主轴制成两个或更多种直径的孔。
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