公开(公告)号：US07210221B2

公开(公告)日：2007-05-01

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P19/02

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US07380329B2

公开(公告)日：2008-06-03

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.

摘要翻译： 头部万向节组件的组装方法。 该方法包括一系列步骤，其包括：堆叠基板，负载梁和挠曲件以形成至少底层为基板系列的三层堆叠系列; 将所述负载梁的部分接合到所述基板，并且将所述弯曲部分连接到所述三层堆叠系列中的所述负载梁以形成悬挂部; 将滑块附接到悬架部分中的挠曲件以制造头部万向节组件; 负载弯曲形成在头部万向节组件中的铰链部分; 并加热铰链部分，以便以预定的弯曲角度将铰链部分上的弯曲载荷调整到预定值。

公开(公告)号：US07161766B2

公开(公告)日：2007-01-09

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. The base plate structure comprises a band portion having conveying holes and positioning holes formed at a predetermined pith respectively in a longitudinal direction. A plurality of the base plates are disposed via connecting portions integrally formed at a predetermined pitch at edges on one side of the band portion.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 基板结构包括具有分别在纵向方向上形成在预定的髓上的输送孔和定位孔的带部分。 多个基板通过在带部分的一侧的边缘处以预定间距整体形成的连接部分设置。

公开(公告)号：US06823581B2

公开(公告)日：2004-11-30

申请号：US09989633

申请日：2001-11-20

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P1902

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US20050028353A1

公开(公告)日：2005-02-10

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  G11B5/012 ,  G11B17/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US20050024777A1

公开(公告)日：2005-02-03

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

公开(公告)号：US20050022372A1

公开(公告)日：2005-02-03

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  B23P19/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US20070263323A1

公开(公告)日：2007-11-15

申请号：US11804035

申请日：2007-05-15

申请人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

发明人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

IPC分类号： G11B5/60

CPC分类号： G11B5/4826 ,  G11B5/6011

摘要： Embodiments in accordance with the present invention provide a magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably, and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the slider. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

摘要翻译： 根据本发明的实施例提供了一种磁头组件，其中可以通过抑制悬架的变形来移除滑块，并且可以稳定地保持磁头的姿态角度，以及安装有磁头组件的磁盘驱动器。 根据实施例的头万向架组件（HGA）包括悬架，设置有磁头元件部分的磁头滑动器和保持滑块并连接到悬架的万向节。 万向节包括在导电粘合剂施加区域周围形成的间隔物。 具有不大于导电粘合剂施加区域的平面尺寸的非导电粘合剂施加区域形成在滑块外部。 万向架和滑块通过施加到导电粘合剂施加区域上的导电粘合剂导通，并且用施加到非导电粘合剂施加区域的非导电粘合剂彼此粘合。

公开(公告)号：US07859793B2

公开(公告)日：2010-12-28

申请号：US11804035

申请日：2007-05-15

申请人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

发明人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

IPC分类号： G11B5/60

CPC分类号： G11B5/4826 ,  G11B5/6011

摘要： A magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and a gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the spacer. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

摘要翻译： 一种磁头组件，其中滑块可以被抑制的悬架的变形移除，并且可以稳定地保持磁头的姿态角度以及安装有磁头组件的磁盘驱动器。 根据实施例的头万向架组件（HGA）包括悬架，设置有磁头元件部分的磁头滑动器和保持滑块并连接到悬架的万向架。 万向节包括在导电粘合剂施加区域周围形成的间隔物。 在间隔物的外侧形成具有不大于导电性粘合剂涂布区域的平面尺寸的非导电性粘合剂涂敷区域。 万向架和滑块通过施加到导电粘合剂施加区域上的导电粘合剂导通，并且用施加到非导电粘合剂施加区域的非导电粘合剂彼此粘合。

公开(公告)号：US20100214817A1

公开(公告)日：2010-08-26

申请号：US12681296

申请日：2008-09-26

申请人： Shigeki Imai ,  Yukihiro Nakamura ,  Hiroyuki Ochi ,  Naohisa Ohta ,  Sadayasu Ono

发明人： Shigeki Imai ,  Yukihiro Nakamura ,  Hiroyuki Ochi ,  Naohisa Ohta ,  Sadayasu Ono

IPC分类号： G11C17/00

CPC分类号： G11C17/10 ,  G11C5/04 ,  G11C7/1006 ,  G11C2207/107 ,  H01L23/48 ,  H01L25/16 ,  H01L31/03921 ,  H01L31/0445 ,  H01L31/048 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y02E10/50 ,  H01L2924/00

摘要： A pn junction type solar cell is formed in a predetermined region on a substrate made of glass. Light emitted from a light emitting unit reaches an n-type semiconductor layer after it passed through substrate. The solar cell generates electromotive force corresponding to a quantity of the emitted light. A control circuit, a mask ROM, a transmitting circuit and an antenna are formed on an upper side of the solar cell. A surface of a semiconductor storage device is entirely covered with an insulating film to block entry of outside air. The insulating film is typically formed of physicochemically stable glass or silicon dioxide.

摘要翻译： 在由玻璃制成的基板上的规定区域形成pn结型太阳能电池。 从发光单元发出的光通过基板后到达n型半导体层。 太阳能电池产生对应于发射光量的电动势。 在太阳能电池的上侧形成有控制电路，掩模ROM，发送电路和天线。 半导体存储装置的表面完全被绝缘膜覆盖以阻止外部空气的进入。 绝缘膜通常由物理化学稳定的玻璃或二氧化硅形成。