公开(公告)号：US20110051314A1

公开(公告)日：2011-03-03

申请号：US12851106

申请日：2010-08-05

申请人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

发明人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

IPC分类号： H01G4/06 ,  H01C7/10 ,  H01F27/28 ,  B23K1/20

CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。