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    LCD including light divergent element at front of display panel
    1.
    发明授权
    LCD including light divergent element at front of display panel 有权
    LCD在显示面板前方包括光发散元件

    公开(公告)号：US06678019B2

    公开(公告)日：2004-01-13

    申请号：US09956941

    申请日：2001-09-21

    申请人： Takashi Sato ,  Noriko Watanabe ,  Shigeaki Mizushima

    发明人： Takashi Sato ,  Noriko Watanabe ,  Shigeaki Mizushima

    IPC分类号： G02F11335

    CPC分类号： G02B6/0046 ,  G02B6/005 ,  G02B6/0051 ,  G02F1/133504 ,  G02F1/133526

    摘要： A transmission type liquid crystal display device includes: a liquid crystal display element including a pair of transparent insulating substrates placed to face each other with a gap therebetween, transparent electrodes being formed on inner surfaces of the substrates, and a liquid crystal material injected in the gap; a light source placed on a back side of the liquid crystal display element; and a light diverging element placed on a front side of the liquid crystal display element, wherein the liquid crystal display device satisfies an expression 0.5 ≦ ∫ - 90 ⁢ ° 90 ⁢ ° ⁢ B ⁢   ⁢ L ⁡ ( θ ) × L ⁢   ⁢ C ⁡ ( θ ) × Dif ⁡ ( 10 ⁢ ° , θ ) ⁢ ⅆ θ ∫ - 90 ⁢ ° 90 ⁢ ° ⁢ B ⁢   ⁢ L ⁡ ( θ ) × L ⁢   ⁢ C ⁡ ( θ ) × Dif ⁡ ( 0 ⁢ ° , θ ) ⁢ ⅆ θ where BL(&thgr;) is a light emitting angle &thgr;—luminance characteristic of the light source, LC(&thgr;) is an incident angle &thgr; to the liquid crystal display element—transmittance characteristic of the liquid crystal display element in a bright state, and Dif(a, &thgr;) is an incident angle &thgr; to the light diverging element—transmittance characteristic of the light diverging element at a light receiving angle a.

    摘要翻译： 透射型液晶显示装置包括：液晶显示元件，包括一对透明绝缘基板，彼此间隔开间隔开，透明电极形成在基板的内表面上，并且液晶材料注入到 间隙; 放置在液晶显示元件背面的光源; 以及放置在液晶显示元件的前侧的发光元件，其中液晶显示装置满足其中BL（θ）是光源的发光角度θ亮度特性的表达式，LC（θ）是 入射角θ与液晶显示元件的亮度状态下的液晶显示元件的透射率特性相对应，Dif（a，θ）是与发光元件的光发散元件透射特性的入射角θ 光接收角度a。

    Method for fabricating a laminate film and method for fabricating a display device
    4.
    发明授权
    Method for fabricating a laminate film and method for fabricating a display device 有权
    叠层膜的制造方法及显示装置的制造方法

    公开(公告)号：US06784962B2

    公开(公告)日：2004-08-31

    申请号：US09948567

    申请日：2001-09-10

    申请人： Yukihiro Sumida ,  Takashi Sato ,  Hidenori Kihara ,  Noriko Watanabe

    发明人： Yukihiro Sumida ,  Takashi Sato ,  Hidenori Kihara ,  Noriko Watanabe

    IPC分类号： G02F11333

    CPC分类号： G02F1/1335 ,  G02F1/133504 ,  G02F1/133526 ,  Y10T428/10 ,  Y10T428/1059 ,  Y10T428/1481 ,  Y10T428/24355

    摘要： Adhesive layers are formed on the two opposing surfaces of a transparent support. At least one of the adhesive layers is made of a material of which the cured state changes by application of external force, such as a photocurable resin. A separator on the adhesive layer is peeled off, and the adhesive layer is irradiated with light. A lens sheet is then pressed against the adhesive layer. The adhesive layer is cured to a degree of hardness with which the adhesion state between lens sheet and the adhesive layer no more changes. In this way, a laminate film of the lens sheet fixed to the transparent support via the adhesive layer is obtained. The laminate film is bonded to a polarizing plate on the viewer's side of a liquid crystal display element via the other adhesive layer.

    摘要翻译： 粘合层形成在透明支撑体的两个相对的表面上。 粘合剂层中的至少一个由固化状态通过施加外力而变化的材料制成，例如光固化树脂。 剥离粘合层上的隔膜，用光照射粘合剂层。 然后将透镜片压在粘合剂层上。 粘合剂层被固化到一定程度的硬度，透镜片和粘合剂层之间的粘合状态不会改变。 以这种方式，获得通过粘合剂层固定到透明支撑体上的透镜片的层压膜。 层叠膜经由另一粘合层与液晶显示元件的观察者侧的偏振片接合。

    Display device including adhesive film with transparent support
    5.
    发明授权
    Display device including adhesive film with transparent support 失效
    显示装置包括具有透明支撑的粘合膜

    公开(公告)号：US07244476B2

    公开(公告)日：2007-07-17

    申请号：US10902828

    申请日：2004-08-02

    申请人： Yukihiro Sumida ,  Takashi Sato ,  Hidenori Kihara ,  Noriko Watanabe

    发明人： Yukihiro Sumida ,  Takashi Sato ,  Hidenori Kihara ,  Noriko Watanabe

    IPC分类号： G02F1/1333

    CPC分类号： G02F1/1335 ,  G02F1/133504 ,  G02F1/133526 ,  Y10T428/10 ,  Y10T428/1059 ,  Y10T428/1481 ,  Y10T428/24355

    摘要： Adhesive layers are formed on the two opposing surfaces of a transparent support. At least one of the adhesive layers is made of a material of which the cured state may be changed. The adhesive layer is irradiated with light and a lens sheet is then pressed against the adhesive layer. The adhesive layer is cured. In this illustrative way, a laminate film of the lens sheet fixed to the transparent support via the adhesive layer may be obtained. The laminate film may be bonded to a polarizing plate on the viewer's side of a liquid crystal display element via the other adhesive layer.

    摘要翻译： 粘合层形成在透明支撑体的两个相对的表面上。 粘合剂层中的至少一个由可以改变固化状态的材料制成。 用光照射粘合剂层，然后将透镜片压在粘合剂层上。 粘合层固化。 以这种说明的方式，可以获得通过粘合剂层固定到透明支撑体的透镜片的层压膜。 层叠膜可以经由另一粘合层与液晶显示元件的观察者侧的偏振片接合。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    7.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号：US20090215247A1

    公开(公告)日：2009-08-27

    申请号：US12434637

    申请日：2009-05-02

    申请人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    发明人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    IPC分类号： H01L21/304

    CPC分类号： H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译： 在扫描装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 晶片通过照明装置（7a）和（7b）。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

    Light illumination during wafer dicing to prevent aluminum corrosion
    8.
    发明授权
    Light illumination during wafer dicing to prevent aluminum corrosion 有权
    晶圆切割时的光照，防止铝腐蚀

    公开(公告)号：US07998793B2

    公开(公告)日：2011-08-16

    申请号：US12434637

    申请日：2009-05-02

    申请人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    发明人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译： 在切割装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 晶片通过照明装置（7a）和（7b）。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

    Manufacturing Method of Semiconductor Device
    9.
    发明申请
    Manufacturing Method of Semiconductor Device 审中-公开
    半导体器件的制造方法

    公开(公告)号：US20080138962A1

    公开(公告)日：2008-06-12

    申请号：US11632993

    申请日：2004-07-22

    申请人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    发明人： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

    IPC分类号： H01L21/304

    CPC分类号： H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译： 在切割装置（1）的盖（8）的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 通过照明装置（7a）和（7b）的晶片。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。