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公开(公告)号：US4737447A
公开(公告)日：1988-04-12
申请号：US873306
申请日：1986-06-09
CPC分类号： B29D11/00269 , G02B5/1876 , G02B6/1221 , G03F7/001 , Y10S359/90 , Y10S430/143 , Y10S430/146
摘要： A process for producing a micro Fresnel lens comprising the following steps: applying a photoresist coat to a smooth-surfaced substrate such as a glass, plastic or metal plate; exposing the resist cost to actinic radiation such as an electron beam, laser beam or UV rays; developing the exposed coat to form a resist pattern duplicating concentric rings for the desired micro Fresnel lens; forming an electrode element on the resist pattern by depositing a conductive metal such as silver or nickel by sputtering or evaporation; forming a nickel layer on the conductive metal electrode element by depositing metallic nickel or a nickel compound through electroforming wherein the pattern of the concentric rings is transferred onto the nickel layer with the conductive metal being used as an electrode; forming a nickel stamper by peeling the nickel layer from both the electrode and the substrate; and forming a micro Fresnel lens on the nickel stamper by either the photopolymerization or injection method of duplication.
摘要翻译： 一种微型菲涅尔透镜的制造方法，包括以下步骤：将光致抗蚀剂涂层施加到光滑表面的基底如玻璃，塑料或金属板上; 将抗蚀剂成本暴露于电子束，激光束或紫外线等光化辐射; 展开曝光的涂层以形成复制用于期望的微型菲涅耳透镜的同心环的抗蚀剂图案; 通过溅射或蒸发沉积诸如银或镍的导电金属在抗蚀剂图案上形成电极元件; 通过电铸沉积金属镍或镍化合物在所述导电金属电极元件上形成镍层，其中所述同心环的图案被转移到所述镍层上，所述导电金属用作电极; 通过从所述电极和所述基板剥离所述镍层来形成镍压模; 以及通过光聚合或注射复制方法在镍压模上形成微菲涅耳透镜。
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公开(公告)号：US4609259A
公开(公告)日：1986-09-02
申请号：US669792
申请日：1984-11-09
CPC分类号： G03F7/001 , G02B5/1876 , G02B5/1885
摘要： A process for producing a micro Fresnel lens comprises the following steps: moving either a substrate coated with a resist layer for providing the micro Fresnel lens or a source of actinic radiation such as electron beam for exposing the resist layer relative to each other in a fixed direction; scanning linearly the resist coat with the actinic radiation in a direction perpendicular to the direction of the relative movement; during the scanning operation, performing exposure to the actinic radiation or interrupting or overlapping the application of the actinic radiation so as to form a latent image in an area corresponding to the grooved surface of the micro Fresnel lens within a predetermined width; repeating the above procedures in a direction perpendicular to that of the relative movement of the substrate and the source of actinic radiation; and developing the exposed resist layer to provide a micro Fresnel lens having the desired grooved surface.
摘要翻译： 用于生产微型菲涅耳透镜的方法包括以下步骤：移动涂覆有用于提供微型菲涅耳透镜的抗蚀剂层的基底或者用于将光致抗蚀剂层相对于彼此暴露于固定的光化辐射的电子束源 方向; 在与相对运动方向垂直的方向上用光化辐射线性地扫描抗蚀剂涂层; 在扫描操作期间，对光化辐射进行曝光或中断或重叠光化辐射的施加，以便在与预定宽度内的微型菲涅耳透镜的带槽表面相对应的区域中形成潜像; 在与基底和光化辐射源的相对运动垂直的方向上重复上述步骤; 并且显影曝光的抗蚀剂层以提供具有所需槽表面的微型菲涅耳透镜。
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公开(公告)号：US4603473A
公开(公告)日：1986-08-05
申请号：US541317
申请日：1983-10-12
申请人： Takashi Suemitsu , Takashi Niriki
发明人： Takashi Suemitsu , Takashi Niriki
IPC分类号： G03F7/20 , G03F9/00 , H01L21/027 , H01L21/30 , H01L23/544 , H05K3/06
CPC分类号： G03F9/7076 , G03F7/7045 , H01L21/0277 , H01L21/30 , H01L23/544 , H01L2223/54453 , H01L2223/54466 , H01L2223/54493 , H01L2924/0002 , Y10S438/949 , Y10S438/975
摘要： A method of fabricating an integrated semiconductor circuit device having a plurality of layers of circuit patterns, comprising forming the circuit pattern of at least one of the above mentioned layers by a direct exposure method using an electron beam, and forming the circuit pattern of at least one of the remaining layers by a light exposure method using a photomask.
摘要翻译： 一种制造具有多层电路图案的集成半导体电路器件的方法，包括通过使用电子束的直接曝光方法形成上述层中的至少一层的电路图案，并且至少形成电路图案 通过使用光掩模的曝光方法的其余层之一。
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