摘要:
A rectangular rear substrate which constitutes an envelope of an image display device is fitted with a reinforcing frame which reinforces the envelope. The reinforcing frame has a pair of first frame portions individually extending substantially parallel to long sides of the rear substrate and a pair of second frame portions extending substantially parallel to short sides of the rear substrate and connecting the first frame portions. Each of the second frame portions meets a relationship ΔH/H=13 to 33%, where H is a length of each long side of the rear substrate and ΔH is a distance between each short side of the rear substrate and each of the second frame portions.
摘要翻译:构成图像显示装置的封套的矩形后基板装配有加固信封的加强框架。 加强框架具有大致平行于后基板的长边大致平行的一对第一框架部分和大致平行于后基板的短边延伸并连接第一框架部分的一对第二框架部分。 每个第二框架部分满足DeltaH / H = 13至33%的关系,其中H是后基板的每个长边的长度,DeltaH是后基板的每个短边与每个第二框架之间的距离 部分。
摘要:
A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.
摘要:
When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.
摘要:
When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.
摘要:
A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.
摘要:
The invention provides a viscoelasticity measuring device which is capable of imparting a desired displacement profile to a sample under conditions close to that of actual use. The viscoelasticity measuring device is composed of a presser to impart displacements to a sample; a rod to convey the displacements to the presser; a control jig kept in contact with an upper end portion of the rod and adapted to move to impart a desired displacement to the rod; a load cell which detects a load exerted to the sample to detect a stress generated in the sample; and a displacement sensor to detect the displacement in the sample; the displacements imparted of the sample being defined in accordance with a configuration and a moving speed of the control jig.
摘要:
According to one embodiment, an electrostatic actuator includes a substrate, an electrode unit, a film body unit, and an urging unit. The electrode unit is provided on the substrate. The film body unit is provided to oppose the electrode unit and is conductive. The urging unit is configured to support the film body unit and includes a connection unit connected to the substrate and an elastic unit provided between the connection unit and the film body unit. A contacting state and a separated state are possible for the electrode unit and the film body unit according to a voltage applied to the electrode unit. The elastic unit has a branch portion between one end of the elastic unit connected to the connection unit and multiple one other ends of the elastic unit connected to the film body unit.
摘要:
According to one embodiment, an electrostatic actuator includes an electrode unit, a conductive film body unit, a plurality of first urging units, and a plurality of second urging units. The electrode unit is provided on a substrate. The conductive film body unit is provided opposing the electrode unit. The plurality of first urging units are provided at a first circumferential edge portion of the conductive film body unit to support the film body unit. The plurality of second urging units are provided at a second circumferential edge portion opposing the first circumferential edge portion to support the film body unit. The electrode unit and the conductive film body unit contact or separate by the electrode unit being set to a voltage having a prescribed value. The plurality of first urging units have mutually different rigidities, and the plurality of second urging units have mutually different rigidities.