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公开(公告)号：US20240308841A1
公开(公告)日：2024-09-19
申请号：US18601334
申请日：2024-03-11
Applicant: ROHM CO., LTD.
Inventor： Toma FUJITA , Martin Wilfried HELLER , Daisuke KAMINISHI , Naoki IZUMI
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B2201/0235 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81B2207/07
Abstract: The present disclosure provides a MEMS device including a device wafer, a cap wafer and a bonding layer. The device wafer includes: a device substrate, having a first main surface, a second main surface opposite to the first main surface, and a cavity recessed along a first direction from the first main surface toward the second main surface; a sensor unit, located within the cavity and mechanically connected to and electrically insulated from the device substrate by a single anchor; and a device wiring, electrically coupled to the sensor unit. The cap wafer includes: a cap substrate, facing the device wafer from a side of the first main surface; and a cap wiring, electrically coupled to the device wiring. The bonding layer bonds the device wafer with the cap wafer, and the device wiring is directly connected to the bonding layer.
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公开(公告)号：US20240174508A1
公开(公告)日：2024-05-30
申请号：US18434743
申请日：2024-02-06
Applicant: xMEMS Labs, Inc.
Inventor： Yanchen Lu , Jemm Yue Liang , Michael David Housholder , JengYaw Jiang
CPC classification number: B81B3/0021 , B81B3/0051 , B81B3/0072 , H04R31/00 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2207/03
Abstract: A wearable sound device includes a venting module, configured to form at least one vent to connect a volume within the wearable sound device and ambient, and a sound producing device, configured to produce sound according to an equalized input signal. The venting module, including at least one venting device, operates among a plurality of statuses corresponding to a plurality of degrees of opening. A controller generates the equalized input signal according to a degree of opening among the plurality of degrees of opening, in order to counteract a roll off caused by the at least one vent.
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公开(公告)号：US11958738B2
公开(公告)日：2024-04-16
申请号：US17872777
申请日：2022-07-25
Applicant: SILICON LIGHT MACHINES CORPORATION
Inventor： Olav Solgaard , Stephen Hamann , Alexander Payne , Lars Eng , James Hunter , Tianbo Liu
CPC classification number: B81B7/02 , B81B2201/047 , B81B2203/0127 , B81B2203/0163 , B81B2203/0353 , B81B2203/04 , B81B2203/051 , B81B2207/05 , B81B2207/096
Abstract: An optical system including a dual-layer microelectromechanical systems (MEMS) device, and methods of fabricating and operating the same are disclosed. Generally, the MEMS device includes a substrate having an upper surface; a top modulating layer including a number of light modulating micro-ribbons, each micro-ribbon supported above and separated from the upper surface of the substrate by spring structures in at least one lower actuating layer; and a mechanism for moving one or more of the micro-ribbons relative to the upper surface and/or each other. The spring structures are operable to enable the light modulating micro-ribbons to move continuously and vertically relative to the upper surface of the substrate while maintaining the micro-ribbons substantially parallel to one another and the upper surface of the substrate. The micro-ribbons can be reflective, transmissive, partially reflective/transmissive, and the device is operable to modulate a phase and/or amplitude of light incident thereon.
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公开(公告)号：US20240106357A1
公开(公告)日：2024-03-28
申请号：US18266963
申请日：2021-10-13
Applicant: SAGINOMIYA SEISAKUSHO, INC.
Inventor： Noriko Shimomura , Hisayuki Ashizawa
CPC classification number: H02N2/188 , B81B3/0021 , B81C1/00166 , B81B2203/0136 , B81B2203/0163 , B81C2201/0132 , B81C2201/0133
Abstract: A great force is prevented from acting on an elastic support section of a MEMS vibration-driven energy harvesting element. A vibration-driven energy harvesting element has a fixed electrode fixed to a base section, a movable electrode movable relative to the fixed electrode, an elastic support section which has one end connected to the base section and the other end connected to the movable electrode and elastically supports the movable electrode, and at least one of a first member which is fixed to the movable electrode and faces the base section or a member fixed to the base section at a distance in a direction orthogonal to a vibration plane on which the movable electrode vibrates, and a second member which is fixed to the base section and faces the movable electrode or a member fixed to the movable electrode at a distance in a direction orthogonal to the vibration plane.
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公开(公告)号：US11863934B2
公开(公告)日：2024-01-02
申请号：US17827813
申请日：2022-05-30
Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD
CPC classification number: H04R19/02 , B81B3/0037 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/019 , B81B2203/0127 , B81B2203/0163 , H04R2201/003
Abstract: The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.
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Patent Agency Ranking
公开(公告)号：US20230382722A1
公开(公告)日：2023-11-30
申请号：US18366201
申请日：2023-08-07
Inventor： Frank SENGER , Shanshan GU-STOPPEL , Erdem YARAR , Gunnar WILLE
CPC classification number: B81C1/00317 , B81B7/0041 , B81C2203/0118 , B81C2201/0123 , B81B2201/032 , B81B2201/042 , B81B2203/0163
Abstract: A method for encapsulating an MEMS structure in a stack structure includes providing a functional wafer structure including at least partly the MEMS structure. The method includes arranging the functional wafer structure and a glass wafer in the stack structure and along a stacking direction and is performed such that a cavity, in which at least part of the MEMS structure is arranged, is closed on one side along the stacking direction by the glass wafer and such that a spacing structure is arranged between the part of the MEMS structure and the glass wafer in the stack structure to provide a spacing between the part of the MEMS structure and the glass wafer along the stacking direction, such that the spacing structure encloses part of the cavity.
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公开(公告)号：US11716033B2
公开(公告)日：2023-08-01
申请号：US17053598
申请日：2019-04-19
Applicant: The University of Tokyo , SAGINOMIYA SEISAKUSHO, INC.
Inventor： Hiroshi Toshiyoshi , Hisayuki Ashizawa , Masahiro Morita
CPC classification number: H02N1/08 , B81B3/0086 , B81B2203/0163
Abstract: A vibration-driven energy harvesting element that outputs an alternating current power from an output line, due to vibration from outside includes: an intermediate electrode that is not connected to the output line; a plurality of electret electrodes, each electret electrode being arranged to face the intermediate electrode and having an electret on at least a part of a surface of the electret electrode on a side facing the intermediate electrode; a holding unit that holds the intermediate electrode and the plurality of electret electrodes such that the intermediate electrode and the plurality of electret electrodes can vibrate with respect to each other; and a charge injector that injects a charge having characteristics opposite to a charge of the electrets formed in the surfaces of the plurality of electret electrodes, to the intermediate electrode.
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公开(公告)号：US20190007759A1
公开(公告)日：2019-01-03
申请号：US15890941
申请日：2018-02-07
Applicant: Akustica, Inc. , Robert Bosch GmbH
Inventor： Daniel Meisel , Andrew Doller
CPC classification number: H04R1/04 , B81B7/0058 , B81B7/0061 , B81B7/02 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , H04R2201/003
Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.
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公开(公告)号：US20180155188A1
公开(公告)日：2018-06-07
申请号：US15875068
申请日：2018-01-19
Applicant: Infineon Technologies Dresden GmbH
Inventor： Thoralf Kautzsch , Heiko Froehlich , Alessia Scire , Maik Stegemann , Bernhard Winkler , Andre Roeth , Steffen Bieselt , Mirko Vogt
CPC classification number: B81C1/0015 , B81B3/0078 , B81B2201/0235 , B81B2203/0118 , B81B2203/0163
Abstract: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
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10.发明申请公开(公告)号：US20180113300A1
公开(公告)日：2018-04-26
申请号：US15790244
申请日：2017-10-23
Applicant: Robert Bosch GmbH
Inventor： Stefan Pinter
CPC classification number: G02B27/0006 , B81B7/0067 , B81B2201/042 , B81B2203/0163 , B81B2203/0384 , B81C1/00317 , B81C1/00626 , B81C2203/035 , B81C2203/037 , G02B26/0833
Abstract: A method for manufacturing a protective wafer including a frame wafer and an optical window, and to a method for manufacturing a micromechanical device including such a protective wafer having an inclined optical window. Also described are a protective wafer including a frame wafer and an optical window, and a micromechanical device including a MEMS wafer and such a protective wafer, which delimit a cavity, the protective wafer including an inclined optical window.
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