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公开(公告)号:US20190007759A1
公开(公告)日:2019-01-03
申请号:US15890941
申请日:2018-02-07
申请人: Akustica, Inc. , Robert Bosch GmbH
发明人: Daniel Meisel , Andrew Doller
CPC分类号: H04R1/04 , B81B7/0058 , B81B7/0061 , B81B7/02 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , H04R2201/003
摘要: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.
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公开(公告)号:US20180155188A1
公开(公告)日:2018-06-07
申请号:US15875068
申请日:2018-01-19
发明人: Thoralf Kautzsch , Heiko Froehlich , Alessia Scire , Maik Stegemann , Bernhard Winkler , Andre Roeth , Steffen Bieselt , Mirko Vogt
CPC分类号: B81C1/0015 , B81B3/0078 , B81B2201/0235 , B81B2203/0118 , B81B2203/0163
摘要: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
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3.
公开(公告)号:US20180113300A1
公开(公告)日:2018-04-26
申请号:US15790244
申请日:2017-10-23
申请人: Robert Bosch GmbH
发明人: Stefan Pinter
CPC分类号: G02B27/0006 , B81B7/0067 , B81B2201/042 , B81B2203/0163 , B81B2203/0384 , B81C1/00317 , B81C1/00626 , B81C2203/035 , B81C2203/037 , G02B26/0833
摘要: A method for manufacturing a protective wafer including a frame wafer and an optical window, and to a method for manufacturing a micromechanical device including such a protective wafer having an inclined optical window. Also described are a protective wafer including a frame wafer and an optical window, and a micromechanical device including a MEMS wafer and such a protective wafer, which delimit a cavity, the protective wafer including an inclined optical window.
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公开(公告)号:US20180086625A1
公开(公告)日:2018-03-29
申请号:US15698604
申请日:2017-09-07
申请人: The Government of the United States of America, as Represented by the Secretary of the Navy , The Charles Stark Draper Laboratory, Inc.
发明人: Francis J. KUB , Karl D. HOBART , Eugene A. IMHOFF , Rachael L. MYERS-WARD , Eugene COOK , Jonathan BERNSTEIN , Marc WEINBERG
IPC分类号: B81B3/00 , B81C1/00 , G01C19/5656 , G01C19/5621 , G01C19/56
CPC分类号: B81B3/0072 , B81B7/0016 , B81B7/0019 , B81B2201/0235 , B81B2201/0242 , B81B2201/0271 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81C1/00666 , B81C2201/0132 , B81C2203/036 , G01C19/56 , G01C19/5621 , G01C19/5656 , G01C19/5783
摘要: Electromechanical device structures are provided, as well as methods for forming them. The device structures incorporate at least a first and second substrate separated by an interface material layer, where the first substrate comprises an anchor material structure and at least one suspended material structure, optionally a spring material structure, and optionally an electrostatic sense electrode. The device structures may be formed by methods that include providing an interface material layer on one or both of the first and second substrates, bonding the interface materials to the opposing first or second substrate or to the other interface material layer, followed by forming the suspended material structure by etching.
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公开(公告)号:US20180085785A1
公开(公告)日:2018-03-29
申请号:US15817360
申请日:2017-11-20
申请人: KOLO MEDICAL, LTD.
发明人: Xuefeng ZHUANG , Yongli HUANG , Dave HONG , Lei CHEN
CPC分类号: B06B1/0292 , B81B3/0037 , B81B3/007 , B81B2201/0257 , B81B2203/0109 , B81B2203/0163 , B81B2203/0307
摘要: In some examples, a method of fabricating a transducer includes disposing a plurality of anchors on a substrate and disposing a sealing material and a device layer over the anchors and the substrate to form a cavity, the sealing material sealing the cavity. The method may further include forming, in the device layer, a plate and at least one spring member. The at least one spring member may be supported by at least one anchor of the plurality of anchors, and the at least one spring member may support the plate to allow relative movement between the plate and the substrate.
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公开(公告)号:US20180073875A1
公开(公告)日:2018-03-15
申请号:US15814373
申请日:2017-11-15
申请人: INVENSENSE, INC.
发明人: Ozan ANAC , Joseph SEEGER
IPC分类号: G01C19/5762 , G01P15/08 , G01C19/5747 , B81B3/00 , G01C19/5733
CPC分类号: G01C19/5762 , B81B3/0051 , B81B2201/0242 , B81B2203/0163 , G01C19/5733 , G01C19/5747 , G01P15/0802
摘要: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.
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7.
公开(公告)号:US20170267516A1
公开(公告)日:2017-09-21
申请号:US15615238
申请日:2017-06-06
发明人: Chung-Yen Chou
CPC分类号: B81B3/001 , B81B2203/0163 , B81B2207/012 , B81C1/00801 , B81C1/00952 , B81C2201/013 , B81C2201/014 , B81C2203/0792
摘要: A method for manufacturing a microelectromechanical systems (MEMS) structure with sacrificial supports to prevent stiction is provided. A first etch is performed into an upper surface of a carrier substrate to form a sacrificial support in a cavity. A thermal oxidation process is performed to oxidize the sacrificial support, and to form an oxide layer lining the upper surface and including the oxidized sacrificial support. A MEMS substrate is bonded to the carrier substrate over the carrier substrate and through the oxide layer. A second etch is performed into the MEMS substrate to form a movable mass overlying the cavity and supported by the oxidized sacrificial support. A third etch is performed into the oxide layer to laterally etch the oxidized sacrificial support and to remove the oxidized sacrificial support. A MEMS structure with anti-stiction bumps is also provided.
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公开(公告)号:US20170253477A1
公开(公告)日:2017-09-07
申请号:US15602760
申请日:2017-05-23
发明人: Lorenzo BALDO , Enri DUQI , Flavio Francesco VILLA
CPC分类号: B81B7/0045 , B81B3/0072 , B81B2201/0228 , B81B2201/025 , B81B2203/0127 , B81B2203/0163 , B81B2203/0315 , B81B2207/012 , B81C1/00182 , B81C1/00325 , B81C2201/0116 , B81C2201/0173 , B81C2203/0785 , G02B26/0858
摘要: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
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公开(公告)号:US09696157B2
公开(公告)日:2017-07-04
申请号:US14750840
申请日:2015-06-25
IPC分类号: G01C19/00 , G01C19/5712 , B81B3/00 , G01C19/5733 , G01C19/5747
CPC分类号: G01C19/5712 , B81B3/0018 , B81B3/0086 , B81B2201/025 , B81B2203/0163 , G01C19/5733 , G01C19/5747
摘要: MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.
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公开(公告)号:US20170187937A1
公开(公告)日:2017-06-29
申请号:US15447940
申请日:2017-03-02
申请人: MEMS Drive, Inc.
发明人: Matthew NG , Roman Gutierrez , Guiqin Wang
CPC分类号: H04N5/2328 , B81B3/0021 , B81B3/007 , B81B2203/0163 , B81B2207/07 , H02N1/008 , H04N5/225 , H04N5/2254 , H04N5/335 , Y10T29/49107
摘要: A MEMS actuator including buckled flexures and a method of assembling the actuator are described. The assembled MEMS actuator includes an inner frame; an outer frame including latched electrical bars, where a first of the latched bars includes a latch protrusion secured to a corresponding latch groove of a second of the latched bars; and buckled flexures coupling the inner frame to the outer frame. The flexures are buckled during assembly of the MEMS actuator by incorporating the electrical bar latching mechanism into the design of the outer frame of the MEMS actuator. In one implementation, the MEMS actuator is assembled by providing a MEMS actuator with unbuckled flexures coupling the outer frame of the MEMS actuator to an inner frame of the MEMS actuator, where the outer frame includes unlatched electrical bars, and latching the electrical bars of the outer frame, resulting in buckled flexures.
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